倍频器

MACOM公司提供一系列可用于各种通信应用的倍频器产品。我们的倍频器产品由有源二倍频器和输出缓冲放大器组成，可以在一定输入功率范围内提供恒定输出功率，从而能够很好地抑制基波和谐波。MACOM可以提供裸片或表面贴装无铅QFN封装的倍频器。

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部件号	订货	描述	最小输入频率(MHz)	最大输入频率(MHz)	最小输出频率(MHz)	最大输出频率(MHz)	输入功率(dBm)	乘法系数	转换损耗(dB)	封装	最低频率(MHz)	VSWR	最大功率(W)	偏置	最大Vtune	最小Vtune	封装类别	ROHS	无铅	硬件手册	应用笔记	特性	最高频率(MHz)	标志	引线精加工	产品照片	Xmicrowave URL	Xmicrowave图片	输出功率(dBm)

MAFC-004403	询问	Frequency Doubler 16 - 24 GHz Output	8000	12000	16000	24000	0	2	12	4mm PQFN-16LD	16000		17				Plastic Surface Mount		Yes	MAFC-004403.pdf	S2083 - Surface Mounting Instructions for PQFN Packages	16 - 24 GHz Output Frequency Range Lead-Free 4 mm, 16-Lead QFN Package 260°C Reflow Compatible RoHS* Compliant High Dynamic Range High 1xFIN and 3xFIN Suppression 17 dBm Output Power	24000			4x4mm-16 lead PQFN.jpg			17
MAFC-010511	询问	Frequency Doubler 16 - 24 GHz Output	8000	12000	16000	24000	0	2	17	3mm PQFN-16LD							Plastic Surface Mount	Yes	Yes	MAFC-010511.pdf	AN3009 - S-Parameter S2P File Format Guide M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages	16 - 24 GHz Output Frequency Range RoHS* Compliant 260°C Reflow Compatible Lead-Free 3 mm, 16-Lead QFN Packag3 High Dynamic Range High 1xFIN and 3xFIN Suppression 17 dBm Output Power				3x3 mm-16 lead PQFN.jpg
FM-107-PIN	询问	Broadband Frequency Doubler, 10—4800 MHz Output	5	2400	10	4800	10	2	11	FP-2	10	1.5	0.3				Ceramic Surface Mount		No	FM-107_FM-108_FMS-109.pdf	AN3009 - S-Parameter S2P File Format Guide M513 - Tape and Reel Packaging for Surface Mount Components	Operates Over Full AMPS/PCN PCS/PHS Band High Fundamental and Third Order Suppression Typical Midband VSWR 1.5:1 Two Hermetic Package Options Low Conversion Loss	4800			MACOM_general.png
FMS-109-PIN	采购	Broadband Frequency Doubler, 10—4800 MHz Output	5	2400	10	4800	10	2	11	SF-1	10	1.5	0.3				Ceramic Surface Mount		No	FM-107_-108_FMS-109.pdf	AN3009 - S-Parameter S2P File Format Guide	Operates Over Full AMPS/PCN PCS/PHS Bands n Low Conversion Loss High Fundamental and Third Order Suppression Typical Midband VSWR 1.5:1 Two Hermetic Package Options	4800			MACOM_general.png
FM-104-PIN	采购	Broadband Frequency Doubler, 150 - 3000 MHz Output	75	1500	150	3000	24	2	10	FP-3	150	2.5	0.3				Ceramic Surface Mount		No	FM-104.pdf	AN3009 - S-Parameter S2P File Format Guide M513 - Tape and Reel Packaging for Surface Mount Components	Hermetic Flatpack MIL-STD-202 Screening Available Maximum Input Power: 300 mW Max. 50 Ohms Nominal Conversion Loss: 10 dB Midband Multioctave Frequency Coverage	3000			FP 3.JPG
FM-105-PIN	采购	Plug-In Frequency Doubler, 20 - 1500 MHz Output	10	750	20	1500	24	2	12	RH-3	20	2	0.3				Through Hole/Solderwave		No	FM-105.pdf	AN3009 - S-Parameter S2P File Format Guide	Relay Header Case MIL-STD-883 Screening Available Maximum Input Power: 300 mW Max. 50 Ohms Nominal Conversion Loss: 12 dB Midband Multioctave Frequency Coverage	1500			MACOM_general.png
FDZ5013	询问	Frequency Doubler	3000	12000	6000	24000	13	2	12	Versapac	3000	2	0.02				Hermetic		No	FDZ5013.pdf	AN3009 - S-Parameter S2P File Format Guide	Input 3 to 12 GHz Hermetically-Sealed Package Input Drive Level +13 dBm (nominal) Output 6 to 24 GHz	12000			MACOM_general.png
CSFD25H	询问	(non-RoHS) Frequency Doubler	10	2400	20	4800	23	2	12	SMT	10	2	0.01				Plastic Surface Mount		No	CSFD25H.pdf	AN3009 - S-Parameter S2P File Format Guide S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices	Input: 10 to 2400 MHz Surface Mount Input Drive Level +23 dBm (Nominal) Output: 20 to 4800 MHz	2400			MACOM_general.png	http://www.xmicrowave.com/product/xm-a4d5-0604d/	Xmicrowave.png
FD26C	询问	Frequency Doubler	50	3300	100	6600	10	2	13	Connectorized-SMA	50	2	0.01				Connectorized		No	FD26.pdf	AN3009 - S-Parameter S2P File Format Guide	Input Frequency 50 to 3300 MHz Hermetically-Sealed Package Input Drive Level: +10 dBm (Nominal) Output: 100 to 6600 MHz	3300			MACOM_general.png
CSFD26	采购	Low Cost Frequency Doubler	50	3300	100	6600	10	2	13.5	SMT	50	2	0.01				Plastic Surface Mount		No	CSFD26.pdf	AN3009 - S-Parameter S2P File Format Guide S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices	Input Frequency 50 to 3300 MHz Surface Mount Input Drive +10 dBm (Nominal) Output Frequency 100 to 6600 MHz	3300			MACOM_general.png	http://www.xmicrowave.com/product/xm-a4a1-0604d/	Xmicrowave.png
SFD26	采购	Frequency Doubler	50	3300	100	6600	10	2	13	SMT	50	2	0.01				Hermetic		No	FD26.pdf	AN3009 - S-Parameter S2P File Format Guide S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices	Input: 50 to 3300 MHz Hermetically-Sealed Package Input Drive level +10 dBm (Nominal) Output: 100 to 6600 MHz	3300			MACOM_general.png	http://www.xmicrowave.com/product/xm-a4d3-0604d/	Xmicrowave.png
FD93	采购	Frequency Doubler	2000	9000	4000	18000	12	2	12	Versapac	2000	1.5	0.02				Hermetic		No	FD93.pdf	AN3009 - S-Parameter S2P File Format Guide	Input: 2 to 9 GHz Hermetically-Sealed Package Input Drive Level: +12 dBm (Nominal) Output: 4 to 18 GHz	9000			MACOM_general.png
FD93C	采购	Frequency Doubler	2000	9000	4000	18000	12	2	12	Connectorized-SMA	2000	1.5	0.08				Connectorized		No	FD93C.pdf	AN3009 - S-Parameter S2P File Format Guide	Input: 2 to 9 GHz Input Drive Level +12 dBm (Nominal) Output: 4 to 18 GHZ Hermetically-Sealed Package	9000			MACOM_general.png
FDC2310	采购	Open Carrier Frequency Doubler For Microwave Telecommunications	1500	8000	3000	16000	10	2	11	Open Carrier	1500	2					Open Carrier		No	FDC2310.pdf	AN3009 - S-Parameter S2P File Format Guide	Input Frequency 1.5 to 8.0 GHz Microstrip Interface Input Drive Level +10 dBm (nominal) Output Frequency 3.0 to 16.0 GHz	8000			MACOM_general.png
FD93H	采购	Frequency Doubler	2000	9000	4000	18000	19	2	12	Versapac	2000	1.5	0.08				Hermetic		No	FD93H.pdf	AN3009 - S-Parameter S2P File Format Guide	Input: 2 to 9 GHz Hermetically-Sealed Package Input Drive Level: +19 dBm (NOMINAL) Output: 4 TO 18 GHz	9000			MACOM_general.png
FD93HC	采购	Frequency Doubler	2000	9000	4000	18000	19	2	12	Connectorized-SMA	2000	1.5	0.08				Connectorized		No	FD93HC.pdf	AN3009 - S-Parameter S2P File Format Guide	Input: 2 to 9 GHz Hermetically-Sealed Package Input Drive Level: +19 dBm (Nominal) Output: 4 to 18 GHz	9000			MACOM_general.png
SFD25H	采购	Frequency Doubler	5	2400	10	4800	23	2	12	SMT	5	1.5	0.2				Hermetic		No	FD25H_FD25HC_SFD25H.pdf	AN3009 - S-Parameter S2P File Format Guide S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices	Input: 5 to 2400 MHz Hermetically-Sealed Package Input Drive Level: +23 dBm (NOMINAL) Output: 10 to 4800 MHz	2400			MACOM_general.png	http://www.xmicrowave.com/product/xm-a4d2-0604d/	Xmicrowave.png
CSFD25	采购	Low Cost Frequency Doubler	10	2400	20	4800	10	2	11.5	SMT		2	0.01				Plastic Surface Mount		No	CSFD25.pdf	AN3009 - S-Parameter S2P File Format Guide S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices	Input: 10 to 2400 MHz Surface Mount Input Drive level +10 dBm (Nominal) Output: 20 to 4800 MHz				MACOM_general.png	http://www.xmicrowave.com/product/xm-a4d4-0604d/	Xmicrowave.png
FD25	采购	Frequency Doubler	5	2400	10	4800	10	2	11.5	TO-8	5	1.5	0.01				Hermetic		No	FD25_FD25C_FD25E_SFD25.pdf	AN3009 - S-Parameter S2P File Format Guide M513 - Tape and Reel Packaging for Surface Mount Components	Input 5 to 2400 MHz Hermetically-Sealed Package Input Drive level +10 dBm (Nominal) Output 10 to 4800 MHz	2400			MACOM_general.png
FDC2710	采购	Open Carrier Frequency Doubler For Microwave Telecommunications	3500	8000	7000	16000	10	2	11.2	Open Carrier	3500	2					Open Carrier		No	FDC2710.pdf	AN3009 - S-Parameter S2P File Format Guide	Input: 3.5 to 8.0 GHz Microstrip Interface Input Drive Level: +10 dBm (NOMINAL) Output:7.0 to 16.0 GHz	8000			MACOM_general.png
FD25C	采购	Frequency Doubler	5	2400	10	4800	10	2	11.5	Connectorized-SMA	5	1.5	0.01				Connectorized		No	FD25_FD25C_FD25E_SFD25.pdf	AN3009 - S-Parameter S2P File Format Guide	Input 5 to 2400 MHz Hermetically-Sealed Package Input Drive level +10 dBm (Nominal) Output 10 to 4800 MHz	2400			MACOM_general.png
FD25H	采购	Frequency Doubler	5	2400	10	4800	23	2	12	TO-8	5	1.5	0.2				Hermetic		No	FD25H_FD25HC_SFD25H.pdf	AN3009 - S-Parameter S2P File Format Guide M513 - Tape and Reel Packaging for Surface Mount Components	Input 5 to 2400 MHz Input Drive Level +23 dBm (nominal) Output: 10 to 4800 MHz Hermetically-Sealed Package	2400			MACOM_general.png
FD25E	采购	Frequency Doubler	5	2400	10	4800	10	2	11.5	Flatpack-SMT	5	1.5	0.01				Ceramic Surface Mount		No	FD25_FD25C_FD25E_SFD25.pdf	AN3009 - S-Parameter S2P File Format Guide	Input 5 to 2400 MHz Hermetically-Sealed Package Input Drive level +10 dBm (Nominal) Output 10 to 4800 MHz	2400			MACOM_general.png
FD25HC	询问	Frequency Doubler	5	2400	10	4800	23	2	12	Connectorized-SMA	5	1.5	0.2				Connectorized		No	FD25H_FD25HC_SFD25H.pdf	AN3009 - S-Parameter S2P File Format Guide	Input 5 to 2400 MHz Hermetically-Sealed Package Input Drive Level: +23 dBm (Nominal) Output: 10 to 4800 MHz	2400			MACOM_general.png
FDZ5013C	询问	Frequency Doubler	3000	12000	6000	24000	13	2	12	Connectorized-SMA	3000	2	0.02				Connectorized		No	FDZ5013C.pdf	AN3009 - S-Parameter S2P File Format Guide	Input 3 to 12 GHz Hermetically-Sealed Package Input Drive Level +13 dBm (Nominal) Output 6 to 24 GHz	12000			MACOM_general.png
SFD25	采购	Frequency Doubler	10	2400	20	4800	10	2	11.5	SMT	5	1.5	0.01				Hermetic		No	FD25_FD25C_FD25E_SFD25.pdf	AN3009 - S-Parameter S2P File Format Guide S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices	Input 5 to 2400 MH Hermetically-Sealed Package Input Drive level +10 dBm (nominal) Output 10 to 4800 MHz	2400			MACOM_general.png	http://www.xmicrowave.com/product/xm-a4d1-0604d/	Xmicrowave.png
XX1000-QT	询问	Doubler and Power Amplifier 7.5 --22.5/15-45 GHz	7500	22500	15000	45000	0	2		3mm PQFN-16LD							Plastic Surface Mount		Yes	XX1000-QT.pdf	AN3009 - S-Parameter S2P File Format Guide M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages	Integrated Doubler and Power Amplifier RoHS* Compliant 260°C Reflow Compatible 50.0 dBc Fundamental Suppression +18.0 dBm Output Power 3X3mm QFN plastic package		X1000	100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C	3x3 mm-16 lead PQFN.jpg			18
XX1007-BD	询问	Doubler 13.5-17.0/27.0-34.0 GHz	13500	17000	27000	34000	8	2		DIE	13500			40	34000	27000	Die		Yes	XX1007-BD-MACOMTech.pdf	AN3009 - S-Parameter S2P File Format Guide AN3018 - Known Good Die Delivery Specification M513 - Tape and Reel Packaging for Surface Mount Components M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs	Integrated Gain, Doubler and Driver Stages RoHS* Compliant 260°C Reflow Compatible 100% Visual Inspection to MIL-STD-883 Method 2010 100% On-Wafer RF, DC & Output Power Testing On-Chip ESD Protection 40.0 dBc Fundamental Suppression +21.0 dBm Output Saturated Power Self-biased Architecture	17000			MACOM_general.png			21
XX1000-BD	询问	Active Doubler 7.5-25.0/15.0-50.0 GHz	7500	25000	15000	50000	0	2		DIE				20	50000	15000	Die		Yes	XX1000-BD.pdf	AN3009 - S-Parameter S2P File Format Guide AN3018 - Known Good Die Delivery Specification M513 - Tape and Reel Packaging for Surface Mount Components M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs	Excellent Broadband Mixer Driver RoHS* Compliant 260°C Reflow Compatible 100% Visual Inspection to MIL-STD-883 Method 2010 100% On-Wafer RF, DC and Output Power Testing +15 dBm Output Drive Excellent LO Driver for MACOM Receivers Single Ended Fed Doubler with Distributed Buffer Amplifier				MACOM_general.png			13
XX1007-QT	询问	Doubler 13.5-17.0/27.0-34.0 GHz	13500	17000	27000	34000	8	2		3mm PQFN-16LD	13500			35	34000	27000	Plastic Surface Mount		Yes	XX1007-QT.pdf	AN3009 - S-Parameter S2P File Format Guide M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages	Integrated Gain, Doubler and Driver Stages RoHS* Compliant 260°C Reflow Compatible 3x3mm QFN Package 100% RF, DC and Output Power Testing On-Chip ESD Protection 35.0 dBc Fundamental Suppression +20.0 dBm Output Saturated Power Integrated Bypassing Capacitor Single Positive Supply, +5V	17000	XX1007-QT	100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C	3x3 mm-16 lead PQFN.jpg			20
XX1002-QH	询问	Active Doubler 2.5 - 6.0 / 5.0 - 12.0 GHz	2500	6000	5000	12000	0	2		4mm PQFN-24LD	2500			35	12000	5000	Plastic Surface Mount		No	XX1002-QH.pdf	AN3009 - S-Parameter S2P File Format Guide M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages	Octave Bandwidth Operation RoHS* Compliant 260°C Reflow Compatible 100% RF, DC and Output Power Testing Lead-Free 4 mm 24-lead QFN Package +5 V, 125 mA Bias -35 dBc Fundamental Leakage +16 dBm Output Power	6000	X1002QHP	100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C	4x4_24-lead PQFN.jpg	http://www.xmicrowave.com/product/xm-a4c6-0404d/	Xmicrowave.png	16
FD26	询问	Frequency Doubler	50	3300	100	6600	10	2	13	TO-8	50	2	0.01				Hermetic		No	FD26.pdf	AN3009 - S-Parameter S2P File Format Guide M513 - Tape and Reel Packaging for Surface Mount Components	Input: 50 TO 3300 MHz Output: 100 TO 6600 MHz Input Drive Level +10 dBm (nominal) Hermetically-Sealed Packaged	3300			MACOM_general.png
XX1010-QT	询问	Doubler 14.625-15.0/29.25-30 GHz	14625	15000	29250	30000	3	2		3mm PQFN-16LD	14625			4.5	30000	29250	Plastic Surface Mount		Yes	XX1010-QT.pdf	AN3009 - S-Parameter S2P File Format Guide M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages	Integrated Gain, Doubler and Driver Stages RoHS* Compliant 260°C Reflow Compatible Lead-Free 3 mm 16-Lead QFN Package 100% RF, DC and Output Power Testing On-Chip ESD Protection 30 dBc Fundamental Suppression +20 dBm Output Saturated Power Integrated Bypassing Capacitor +4.5 V Single Positive Bias	15000	X1010	100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C	3x3 mm-16 lead PQFN.jpg			20

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