倍频器

倍频器

MACOM公司提供一系列可用于各种通信应用的倍频器产品。我们的倍频器产品由有源二倍频器和输出缓冲放大器组成,可以在一定输入功率范围内提供恒定输出功率,从而能够很好地抑制基波和谐波。MACOM可以提供裸片或表面贴装无铅QFN封装的倍频器。

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部件号 订货 描述 最小输入频率(MHz) 最大输入频率(MHz) 最小输出频率(MHz) 最大输出频率(MHz) 输入功率(dBm) 乘法系数 转换损耗(dB) 封装 优势 最低频率(MHz) VSWR 最大功率(W) 偏置 最大Vtune 最小Vtune 相位噪声10KHz RF下的Pout RF/2下的Pout 封装类别 ROHS 无铅 硬件手册 模型数据(Sparameters) 应用笔记 特性 最高频率(MHz) 标志 引线精加工 兼容部件 产品照片 MSL ESD 产品介绍 产品公告 外形图 质量报告 Brightcove视频 ADS & SPICE模型信息 数据手册封装概述 设备固件 EVM GUI软件 EVM用户手册 目录 Xmicrowave URL Xmicrowave图片 输出功率(dBm)
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
MAFC-004403 询问 Frequency Doubler 16 - 24 GHz Output
8000 12000 16000 24000 0 2 12 4mm PQFN-16LD
16000 17 Plastic Surface Mount
Yes
MAFC-004403.pdf
S2083 - Surface Mounting Instructions for PQFN Packages
16 - 24 GHz Output Frequency Range
Lead-Free 4 mm, 16-Lead QFN Package
260°C Reflow Compatible
RoHS* Compliant
High Dynamic Range
High 1xFIN and 3xFIN Suppression
17 dBm Output Power
24000 4x4mm-16 lead PQFN.jpg
17
MAFC-010511 询问 Frequency Doubler 16 - 24 GHz Output
8000 12000 16000 24000 0 2 17 3mm PQFN-16LD
Plastic Surface Mount
Yes
Yes
MAFC-010511.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
16 - 24 GHz Output Frequency Range
RoHS* Compliant
260°C Reflow Compatible
Lead-Free 3 mm, 16-Lead QFN Packag3
High Dynamic Range
High 1xFIN and 3xFIN Suppression
17 dBm Output Power
3x3 mm-16 lead PQFN.jpg
FM-107-PIN 询问 Broadband Frequency Doubler, 10—4800 MHz Output
5 2400 10 4800 10 2 11 FP-2
10 1.5 0.3 Ceramic Surface Mount
No
FM-107_FM-108_FMS-109.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
Operates Over Full AMPS/PCN PCS/PHS Band
High Fundamental and Third Order Suppression
Typical Midband VSWR 1.5:1
Two Hermetic Package Options
Low Conversion Loss
4800 MACOM_general.png
FMS-109-PIN 采购 Broadband Frequency Doubler, 10—4800 MHz Output
5 2400 10 4800 10 2 11 SF-1
10 1.5 0.3 Ceramic Surface Mount
No
FM-107_-108_FMS-109.pdf
AN3009 - S-Parameter S2P File Format Guide
Operates Over Full AMPS/PCN PCS/PHS Bands n Low Conversion Loss
High Fundamental and Third Order Suppression
Typical Midband VSWR 1.5:1
Two Hermetic Package Options
4800 MACOM_general.png
FM-104-PIN 采购 Broadband Frequency Doubler, 150 - 3000 MHz Output
75 1500 150 3000 24 2 10 FP-3
150 2.5 0.3 Ceramic Surface Mount
No
FM-104.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
Hermetic Flatpack
MIL-STD-202 Screening Available
Maximum Input Power: 300 mW Max.
50 Ohms Nominal
Conversion Loss: 10 dB Midband
Multioctave Frequency Coverage
3000 FP 3.JPG
FM-105-PIN 采购 Plug-In Frequency Doubler, 20 - 1500 MHz Output
10 750 20 1500 24 2 12 RH-3
20 2 0.3 Through Hole/Solderwave
No
FM-105.pdf
AN3009 - S-Parameter S2P File Format Guide
Relay Header Case
MIL-STD-883 Screening Available
Maximum Input Power: 300 mW Max.
50 Ohms Nominal
Conversion Loss: 12 dB Midband
Multioctave Frequency Coverage
1500 MACOM_general.png
FDZ5013 询问 Frequency Doubler
3000 12000 6000 24000 13 2 12 Versapac
3000 2 0.02 Hermetic
No
FDZ5013.pdf
AN3009 - S-Parameter S2P File Format Guide
Input 3 to 12 GHz
Hermetically-Sealed Package
Input Drive Level +13 dBm (nominal)
Output 6 to 24 GHz
12000 MACOM_general.png
CSFD25H 询问 (non-RoHS) Frequency Doubler
10 2400 20 4800 23 2 12 SMT
10 2 0.01 Plastic Surface Mount
No
CSFD25H.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input: 10 to 2400 MHz
Surface Mount
Input Drive Level +23 dBm (Nominal)
Output: 20 to 4800 MHz
2400 MACOM_general.png
http://www.xmicrowave.com/product/xm-a4d5-0604d/
Xmicrowave.png
FD26C 询问 Frequency Doubler
50 3300 100 6600 10 2 13 Connectorized-SMA
50 2 0.01 Connectorized
No
FD26.pdf
AN3009 - S-Parameter S2P File Format Guide
Input Frequency 50 to 3300 MHz
Hermetically-Sealed Package
Input Drive Level: +10 dBm (Nominal)
Output: 100 to 6600 MHz
3300 MACOM_general.png
CSFD26 采购 Low Cost Frequency Doubler
50 3300 100 6600 10 2 13.5 SMT
50 2 0.01 Plastic Surface Mount
No
CSFD26.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input Frequency 50 to 3300 MHz
Surface Mount
Input Drive +10 dBm (Nominal)
Output Frequency 100 to 6600 MHz
3300 MACOM_general.png
http://www.xmicrowave.com/product/xm-a4a1-0604d/
Xmicrowave.png
SFD26 采购 Frequency Doubler
50 3300 100 6600 10 2 13 SMT
50 2 0.01 Hermetic
No
FD26.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input: 50 to 3300 MHz
Hermetically-Sealed Package
Input Drive level +10 dBm (Nominal)
Output: 100 to 6600 MHz
3300 MACOM_general.png
http://www.xmicrowave.com/product/xm-a4d3-0604d/
Xmicrowave.png
FD93 采购 Frequency Doubler
2000 9000 4000 18000 12 2 12 Versapac
2000 1.5 0.02 Hermetic
No
FD93.pdf
AN3009 - S-Parameter S2P File Format Guide
Input: 2 to 9 GHz
Hermetically-Sealed Package
Input Drive Level: +12 dBm (Nominal)
Output: 4 to 18 GHz
9000 MACOM_general.png
FD93C 采购 Frequency Doubler
2000 9000 4000 18000 12 2 12 Connectorized-SMA
2000 1.5 0.08 Connectorized
No
FD93C.pdf
AN3009 - S-Parameter S2P File Format Guide
Input: 2 to 9 GHz
Input Drive Level +12 dBm (Nominal)
Output: 4 to 18 GHZ
Hermetically-Sealed Package
9000 MACOM_general.png
FDC2310 采购 Open Carrier Frequency Doubler For Microwave Telecommunications
1500 8000 3000 16000 10 2 11 Open Carrier
1500 2 Open Carrier
No
FDC2310.pdf
AN3009 - S-Parameter S2P File Format Guide
Input Frequency 1.5 to 8.0 GHz
Microstrip Interface
Input Drive Level +10 dBm (nominal)
Output Frequency 3.0 to 16.0 GHz
8000 MACOM_general.png
FD93H 采购 Frequency Doubler
2000 9000 4000 18000 19 2 12 Versapac
2000 1.5 0.08 Hermetic
No
FD93H.pdf
AN3009 - S-Parameter S2P File Format Guide
Input: 2 to 9 GHz
Hermetically-Sealed Package
Input Drive Level: +19 dBm (NOMINAL)
Output: 4 TO 18 GHz
9000 MACOM_general.png
FD93HC 采购 Frequency Doubler
2000 9000 4000 18000 19 2 12 Connectorized-SMA
2000 1.5 0.08 Connectorized
No
FD93HC.pdf
AN3009 - S-Parameter S2P File Format Guide
Input: 2 to 9 GHz
Hermetically-Sealed Package
Input Drive Level: +19 dBm (Nominal)
Output: 4 to 18 GHz
9000 MACOM_general.png
SFD25H 采购 Frequency Doubler
5 2400 10 4800 23 2 12 SMT
5 1.5 0.2 Hermetic
No
FD25H_FD25HC_SFD25H.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input: 5 to 2400 MHz
Hermetically-Sealed Package
Input Drive Level: +23 dBm (NOMINAL)
Output: 10 to 4800 MHz
2400 MACOM_general.png
http://www.xmicrowave.com/product/xm-a4d2-0604d/
Xmicrowave.png
CSFD25 采购 Low Cost Frequency Doubler
10 2400 20 4800 10 2 11.5 SMT
2 0.01 Plastic Surface Mount
No
CSFD25.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input: 10 to 2400 MHz
Surface Mount
Input Drive level +10 dBm (Nominal)
Output: 20 to 4800 MHz
MACOM_general.png
http://www.xmicrowave.com/product/xm-a4d4-0604d/
Xmicrowave.png
FD25 采购 Frequency Doubler
5 2400 10 4800 10 2 11.5 TO-8
5 1.5 0.01 Hermetic
No
FD25_FD25C_FD25E_SFD25.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
Input 5 to 2400 MHz
Hermetically-Sealed Package
Input Drive level +10 dBm (Nominal)
Output 10 to 4800 MHz
2400 MACOM_general.png
FDC2710 采购 Open Carrier Frequency Doubler For Microwave Telecommunications
3500 8000 7000 16000 10 2 11.2 Open Carrier
3500 2 Open Carrier
No
FDC2710.pdf
AN3009 - S-Parameter S2P File Format Guide
Input: 3.5 to 8.0 GHz
Microstrip Interface
Input Drive Level: +10 dBm (NOMINAL)
Output:7.0 to 16.0 GHz
8000 MACOM_general.png
FD25C 采购 Frequency Doubler
5 2400 10 4800 10 2 11.5 Connectorized-SMA
5 1.5 0.01 Connectorized
No
FD25_FD25C_FD25E_SFD25.pdf
AN3009 - S-Parameter S2P File Format Guide
Input 5 to 2400 MHz
Hermetically-Sealed Package
Input Drive level +10 dBm (Nominal)
Output 10 to 4800 MHz
2400 MACOM_general.png
FD25H 采购 Frequency Doubler
5 2400 10 4800 23 2 12 TO-8
5 1.5 0.2 Hermetic
No
FD25H_FD25HC_SFD25H.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
Input 5 to 2400 MHz
Input Drive Level +23 dBm (nominal)
Output: 10 to 4800 MHz
Hermetically-Sealed Package
2400 MACOM_general.png
FD25E 采购 Frequency Doubler
5 2400 10 4800 10 2 11.5 Flatpack-SMT
5 1.5 0.01 Ceramic Surface Mount
No
FD25_FD25C_FD25E_SFD25.pdf
AN3009 - S-Parameter S2P File Format Guide
Input 5 to 2400 MHz
Hermetically-Sealed Package
Input Drive level +10 dBm (Nominal)
Output 10 to 4800 MHz
2400 MACOM_general.png
FD25HC 询问 Frequency Doubler
5 2400 10 4800 23 2 12 Connectorized-SMA
5 1.5 0.2 Connectorized
No
FD25H_FD25HC_SFD25H.pdf
AN3009 - S-Parameter S2P File Format Guide
Input 5 to 2400 MHz
Hermetically-Sealed Package
Input Drive Level: +23 dBm (Nominal)
Output: 10 to 4800 MHz
2400 MACOM_general.png
FDZ5013C 询问 Frequency Doubler
3000 12000 6000 24000 13 2 12 Connectorized-SMA
3000 2 0.02 Connectorized
No
FDZ5013C.pdf
AN3009 - S-Parameter S2P File Format Guide
Input 3 to 12 GHz
Hermetically-Sealed Package
Input Drive Level +13 dBm (Nominal)
Output 6 to 24 GHz
12000 MACOM_general.png
SFD25 采购 Frequency Doubler
10 2400 20 4800 10 2 11.5 SMT
5 1.5 0.01 Hermetic
No
FD25_FD25C_FD25E_SFD25.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input 5 to 2400 MH
Hermetically-Sealed Package
Input Drive level +10 dBm (nominal)
Output 10 to 4800 MHz
2400 MACOM_general.png
http://www.xmicrowave.com/product/xm-a4d1-0604d/
Xmicrowave.png
XX1000-QT 询问 Doubler and Power Amplifier 7.5 --22.5/15-45 GHz
7500 22500 15000 45000 0 2 3mm PQFN-16LD
Plastic Surface Mount
Yes
XX1000-QT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
Integrated Doubler and Power Amplifier
RoHS* Compliant
260°C Reflow Compatible
50.0 dBc Fundamental Suppression
+18.0 dBm Output Power
3X3mm QFN plastic package
X1000
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
3x3 mm-16 lead PQFN.jpg
18
XX1007-BD 询问 Doubler 13.5-17.0/27.0-34.0 GHz
13500 17000 27000 34000 8 2 DIE
13500 40 34000 27000 Die
Yes
XX1007-BD-MACOMTech.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
Integrated Gain, Doubler and Driver Stages
RoHS* Compliant
260°C Reflow Compatible
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF, DC & Output Power Testing
On-Chip ESD Protection
40.0 dBc Fundamental Suppression
+21.0 dBm Output Saturated Power
Self-biased Architecture
17000 MACOM_general.png
21
XX1000-BD 询问 Active Doubler 7.5-25.0/15.0-50.0 GHz
7500 25000 15000 50000 0 2 DIE
20 50000 15000 Die
Yes
XX1000-BD.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
Excellent Broadband Mixer Driver
RoHS* Compliant
260°C Reflow Compatible
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF, DC and Output Power Testing
+15 dBm Output Drive
Excellent LO Driver for MACOM Receivers
Single Ended Fed Doubler with Distributed Buffer Amplifier
MACOM_general.png
13
XX1007-QT 询问 Doubler 13.5-17.0/27.0-34.0 GHz
13500 17000 27000 34000 8 2 3mm PQFN-16LD
13500 35 34000 27000 Plastic Surface Mount
Yes
XX1007-QT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
Integrated Gain, Doubler and Driver Stages
RoHS* Compliant
260°C Reflow Compatible
3x3mm QFN Package
100% RF, DC and Output Power Testing
On-Chip ESD Protection
35.0 dBc Fundamental Suppression
+20.0 dBm Output Saturated Power
Integrated Bypassing Capacitor
Single Positive Supply, +5V
17000 XX1007-QT
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
3x3 mm-16 lead PQFN.jpg
20
XX1002-QH 询问 Active Doubler 2.5 - 6.0 / 5.0 - 12.0 GHz
2500 6000 5000 12000 0 2 4mm PQFN-24LD
2500 35 12000 5000 Plastic Surface Mount
No
XX1002-QH.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
Octave Bandwidth Operation
RoHS* Compliant
260°C Reflow Compatible
100% RF, DC and Output Power Testing
Lead-Free 4 mm 24-lead QFN Package
+5 V, 125 mA Bias
-35 dBc Fundamental Leakage
+16 dBm Output Power
6000 X1002QHP
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
4x4_24-lead PQFN.jpg
http://www.xmicrowave.com/product/xm-a4c6-0404d/
Xmicrowave.png
16
FD26 询问 Frequency Doubler
50 3300 100 6600 10 2 13 TO-8
50 2 0.01 Hermetic
No
FD26.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
Input: 50 TO 3300 MHz
Output: 100 TO 6600 MHz
Input Drive Level +10 dBm (nominal)
Hermetically-Sealed Packaged
3300 MACOM_general.png
XX1010-QT 询问 Doubler 14.625-15.0/29.25-30 GHz
14625 15000 29250 30000 3 2 3mm PQFN-16LD
14625 4.5 30000 29250 Plastic Surface Mount
Yes
XX1010-QT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
Integrated Gain, Doubler and Driver Stages
RoHS* Compliant
260°C Reflow Compatible
Lead-Free 3 mm 16-Lead QFN Package
100% RF, DC and Output Power Testing
On-Chip ESD Protection
30 dBc Fundamental Suppression
+20 dBm Output Saturated Power
Integrated Bypassing Capacitor
+4.5 V Single Positive Bias
15000 X1010
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
3x3 mm-16 lead PQFN.jpg
20
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