MA4SPS302

Surmount PIN Diode

This device is a Silicon-Glass PIN diode chip fabricated with MACOM’s patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical conic topology provides for exceptional heat transfer from the active area. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.

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Product Specifications

Part Number: MA4SPS302
Description: Surmount PIN Diode
Breakdown Voltage, Minimum(V): 100
Resistance(Ohm): 1.30
Total Capacitance(pF): 0.400
Lifetime(nS): 460
CW Power Dissipation(W): 0.8
Thermal Resistance(°C/W): 125.0
Package: Surmount Die
Package Category: Surface Mount Die
Min Frequency(MHz): 1
Max Frequency(MHz): 26000

Features

Surface Mount
RoHS Compliant
Low Parasitic Capacitance and Inductance
Polymer Scratch Protection
Silicon Nitride Passivation
Rugged Silicon-Glass Construction
No Wire Bonding Required
High Average and Peak Power Handling

Applications

Aerospace and Defense
ISM

Technical Resources

Datasheet

MA4SPS302.pdf

Application Notes

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MA4SPS302

Diode,Switch,HMIC,Surface_Mount

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