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MACOM’s attenuators are used in a variety of applications for automotive and wireless markets, including 75 Ohm versions for CATV. We offer serial and parallel logic controlled digital attenuators and voltage variable analog attenuators (VVAs) that range from DC to 40GHz. Typical applications include; CATV Infrastructure, Cellular infrastructure, Handset gain control, Radar systems, Satellite radios and Test equipment.
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Parametric Search
| releaseDate | Part Number | Ordering | Min Frequency (MHz) | Max Frequency (MHz) | Bit Count | Attenuator Range (dB) | Insertion Loss (dB) | LSB (dB) | IIP3 (dBm) | Package | Model Data (Sparameters) | Package Category | Lead-Free | Datasheet | Application Notes | TTL Driver | Features | Marking | Lead Finish | Product Image | Short Description | ROHS |
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| 2014/05/14 | MAAD-011021 | Buy | 0 | 30000 | 6 | 31.5 | 6 | 0.5 | 38 |
3mm PQFN-16LD
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Plastic Surface Mount
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Yes
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MAAD-011021.pdf
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No
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6-bit, 0.5 dB LSB, 31.5 dB range
Low RMS phase 4.3° @ 20 GHz +/- 0.5 dB typical bit error Integrated TTL 0/+5V control DC to 30 GHz operation ESD protection for all controls and bias Lead-Free 3 mm 16-lead PQFN package |
Digital Attenuator, 6-Bit, 0.5 dB LSB step
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| 2014/05/14 | MAAD-011021-DIE | Inquire | 0 | 40000 | 6 | 31.5 | 6 | 0.5 | 38 |
DIE
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MAAD-011021-000die__7312013_probed_on_die.zip
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1.55 x 0.95 x 0.1 mm
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Yes
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MAAD-011021-000DIE.pdf
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No
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6-bit, 0.5 dB LSB, 31.5 dB range
+/- 0.5 dB typical bit error Integrated TTL 0/+5V control DC to 40 GHz operation ESD protection for all controls and bias Die size: 1.55 x 0.95 x 0.1 mm Low RMS phase 4.3° @ 20 GHz 100% On-wafer DC & RF Tested |
Digital Attenuator, 6-Bit, 0.5 dB LSB step
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Yes
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| 2012/08/07 | MAADSS0019 | Buy | 2000 | 6000 | 4 | 15 | 1.9 | 1 | 42 |
3mm PQFN-16LD
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Plastic Surface Mount
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Yes
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MAADSS0019.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
No
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Integrated e/d Logic on Chip
RoHS* Compliant 260°C Reflow Compatible Halogen-Free “Green” Mold Compound Lead-Free 3 mm 16-Lead PQFN Package 1 dB Attenuation Steps to 15 dB 42 dBm Typical @ 2.0 GHz Insertion Loss 1.9 dB @ 6.0 GHz Positive Single Control |
3x3 mm-16 lead PQFN.jpg
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Digital Attenuator, 4-Bit, Single Control 15 dB, 2.0 - 6.0 GHz
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Yes
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| 2010/09/24 | MAAD-008790-000100 | Buy | 0 | 4000 | 5 | 31 | 5.5 | 1 | 37 |
4x6mm PQFN-32LD
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Plastic Surface Mount
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Yes
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MAAD-008790.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1.0 dB Steps to 3.0 dB
RoHS* Compliant Test Boards are Available 50 ohm Impedance Integral TTL Driver Small Footprint, PQFN Package Low DC Power Consumption Phase error: ± 3º Typical at 2 GHz |
CSP 1 - 6 x 4 32 Lead.JPG
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Constant Phase Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-4.0 GHz
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| 2008/11/22 | MAAD-007084-000100 | Buy | 0 | 2000 | 5 | 15.5 | 3 | 0.5 | 48 |
SOW16
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Plastic Surface Mount
|
Yes
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MAAD-007084.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 0.5 dB Steps to 15.5 dB
RoHS* Compliant Version of AT65-0283 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOW-16 Package Tape and Reel Packaging Available Test Boards are Available 50 Ohm Impedance Integral TTL Driver Low DC Power Consumption |
SOW 16.jpg
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Digital Attenuator 15.5 dB, 5-Bit, TTL Driver, DC-2.0 GHz
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| 2008/01/31 | MAAD-009170-000100 | Buy | 50 | 4000 | 5 | 15.5 | 5.2 | 0.5 | 40 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
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MAAD-009170.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 0.5 dB Steps to 15.5 dB
RoHS* Compliant Test Boards are Available 50 ohm Impedance Integral TTL Driver Small Footprint, PQFN Package Low DC Power Consumption Minimal Phase Variation over Attenuation Range |
CSP 1 - 6 x 4 32 Lead.JPG
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Digital Attenuator, Constant Phase 15.5 dB, 5-Bit, TTL Driver, DC-4.0 GHz
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| 2008/01/31 | MAAD-009195-000100 | Buy | 50 | 3000 | 5 | 15.5 | 5.3 | 0.5 | 40 |
CR-12
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Ceramic Surface Mount
|
Yes
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MAAD-009195.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 0.5 dB steps to 15.5 dB
RoHS* Compliant 260°C Reflow Compatible 50 ? Nominal Impedance Integral TTL Driver Hermetic Surface Mount Package Low DC Power Consumption Minimal Phase Variation over Attenuation Range |
CR 12.JPG
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Constant Phase Digital Attenuator 15.5 dB, 5-Bit, TTL Driver, DC-3.0 GHz Rev.
|
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| 2008/01/03 | MAAD-009194-000100 | Buy | 50 | 3000 | 5 | 31 | 5.3 | 1 | 41 |
CR-12
|
Ceramic Surface Mount
|
Yes
|
MAAD-009194.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 1 dB steps to 31 dB
RoHS* Compliant 260°C Reflow Compatible 50 ? Nominal Impedance Integral TTL Driver Hermetic Surface Mount Package Low DC Power Consumption Minimal Phase Variation over Attenuation Range |
CR 12.JPG
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Constant Phase Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-3.0 GHz
|
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| 2008/01/02 | MAATSS0019 | Buy | 500 | 4000 | 4 | 15 | 1.3 | 1 | 47 |
TSSOP16
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MAATSS0019_SPAR.zip
|
Plastic Surface Mount
|
Yes
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MAATSS0019.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
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Single Control CMOS Logic for Each Bit
RoHS* Compliant 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free TSSOP-16 Package Low DC Power Consumption: 50 µW 1 dB Steps to 15 dB |
TSSOP-16.jpg
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Digital Attenuator, 4-Bit, Single Control, 15 dB 0.5 - 4.0 GHz
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| 2007/12/05 | MAAD-007081-000100 | Buy | 0 | 3500 | 5 | 15.5 | 3.2 | 0.5 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007081.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 0.5 dB Steps to 15.5 dB
RoHS* Compliant Version of AT90-0283 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Test Boards are Available 50 ohm Impedance Integral TTL Driver Small Footprint, JEDEC Package Low DC Power Consumption Lead-Free CSP-1 Package Tape and Reel Packaging Available |
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 15.5 dB, 5-Bit, TTL Driver, DC-3.5 GHz
|
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| 2007/09/21 | MAADSS0016 | Buy | 50 | 4000 | 5 | 31 | 1.5 | 1 | 42 |
3mm PQFN-16LD
|
MAADSS0016_Spars_Major_states.zip
|
Plastic Surface Mount
|
Yes
|
MAADSS0016.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
No
|
Integrated Logic
RoHS* Compliant 260°C Reflow Compatible Halogen-Free “Green” Mold Compound Lead-Free 3mm PQFN-16LD Plastic Package Low DC Power Consumption 1-dB Attenuation Steps to 31 dB Attenuation Accuracy: 0.3 dB + 1% @ 1.0 GHz -40 dBm typical @ 2.0 GHz Insertion Loss: 1.5 dB @ 1.0 GHz Positive Single Control |
3x3 mm-16 lead PQFN.jpg
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Digital Attenuator, 5-Bit, Single Control 31 dB, 0.05 - 4.0 GHz
|
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| 2007/07/11 | MAAD-007079-000100 | Buy | 0 | 2500 | 4 | 30 | 2.7 | 2 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007079.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 2 dB Steps to 30 dB
RoHS* Compliant Version of AT90-1233 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package Tape and Reel Packaging Available Test Boards Available 50 Ohm Impedance Integral TTL Driver Contains Internal DC to DC Converter Single Positive Supply |
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 30.0 dB, 4-Bit, TTL Driver, DC-2.5 GHz
|
||||
| 2007/07/09 | MAAD-007080-000100 | Buy | 0 | 2400 | 6 | 50 | 6 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007080.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1 dB Steps to 50 dB
RoHS* Compliant Version of AT90-1106 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package 50 ohm Impedance Integral TTL Driver Small Footprint, JEDEC Package Low DC Power Consumption Contains Internal DC to DC Converter Single Positive Supply |
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 50.0 dB, 6-Bit, TTL Driver, DC-2.4 GHz Rev
|
||||
| 2007/05/28 | MAADSS0012 | Buy | 800 | 8000 | 1 | 21 | 0.6 | 21 | 41 |
2mm PDFN-8LD
|
MAADSS0012.zip
|
Plastic Surface Mount
|
Yes
|
MAADSS0012.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
No
|
Vc: 2.5
IP1dB: 25 RoHS* Compliant 260°C Re-flow Compatible 21 dB Step Attenuator Halogen-Free “Green” Mold Compound Lead-Free 2mm 8-Lead PDFN Package -42 dBm typical @ 2.0 GHz Current Consumption: 40 µA typical Insertion Loss: 0.75 dB typical @ 2.0 GHz Positive Control: 2.5 V typical |
12
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
2x2mm_8-lead PQFN.jpg
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Digital Attenuator, 1-Bit, Single Control 21 dB, 0.8 - 8.0 GHz
|
Yes
|
| 2007/03/31 | MAATCC0012 | Buy | 0 | 2500 | 4 | 30 | 2.7 | 2 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAATCC0012.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 2 dB Steps to 30 dB
RoHS* Compliant Version of AT90-0233 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package Tape and Reel Packaging Available Test Boards Available 50 Ohm Impedance Integral TTL Driver Small Footprint, JEDEC Package Low DC Power Consumption |
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 30.0 dB, 4-Bit, TTL Driver, DC-2.5 GHz
|
||||
| 2007/02/02 | MAAD-007077-000100 | Buy | 50 | 4000 | 4 | 15 | 2.5 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007077.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1 dB Steps to 15 dB
RoHS* Compliant Version of AT90-1413 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 00% Matte Tin Plating over Copper Lead-Free CSP-1 Package Tape and Reel Packaging Available Test Boards Available 50 Ohm Impedance Integral TTL Driver Contains Internal DC to DC Converter Single Positive Supply |
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 15 dB, 4-Bit, TTL Driver, DC-4.0 GHz
|
||||
| 2006/09/17 | MAATCC0014 | Buy | 0 | 3500 | 5 | 15.5 | 3.2 | 0.5 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAATCC0014.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 0.5 dB Steps to 15.5 dB
RoHS* Compliant Version of AT90-1283 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package 50 ohm Impedance Integral TTL Driver Small Footprint, JEDEC Package Low DC Power Consumption Single Positive Supply Contains Internal DC to DC Converter |
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 15.5 dB, 5-Bit, TTL Driver, DC-3.5 GHz
|
||||
| 2006/08/29 | MAADSS0009 | Buy | 0 | 2000 | 4 | 30 | 1.6 | 2 | 50 |
SOIC16
|
Plastic Surface Mount
|
Yes
|
MAADSS0009.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
IP1dB: 28, LSB: 2.0
Vc: 5.0 RoHS* Compliant Version of AT-220 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOIC-16 Plastic Package Temperature Stability +/-0.15 dB: -40°C to +85°C Attenuation 2-dB Steps to 30 dB Low DC Power Consumption: 50 µW Low Intermodulation Product: +50 dBm IP3 High Accuracy |
MAADSS0009
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
soic-16.jpg
|
Digital Attenuator, 30 dB, 4-Bit DC - 2.0 GHz
|
Yes
|
|
| 2006/06/22 | MAAD-007083-000100 | Buy | 0 | 6000 | 5 | 31 | 3 | 1 | 48 |
4x6mm PQFN-32LD
|
maad-007083_s2p_files.zip
|
Plastic Surface Mount
|
Yes
|
MAAD-007083.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
IP1dB: 24.0, LSB: 1
Vc: 5.0? RoHS* Compliant Version of AT90-0001 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package Tape and Reel Packaging Available Test Boards are Available Integral TTL Driver Small Footprint, JEDEC Package High Accuracy to 6 GHz Attenuation: 1.0 dB Steps to 31 dB 50 ohm impedance |
AD00708301
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator, 31.0 dB, 5-Bit, TTL Driver, DC-6.0 GHz
|
|
| 2006/05/25 | MAAD-007078-000100 | Buy | 0 | 3000 | 5 | 31 | 3.5 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007078.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1.0dB Steps to 31dB
RoHS* Compliant Version of AT90-1263 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package 50 ohm Impedance Integral TTL Driver Small Footprint, JEDEC Package Low DC Power Consumption Contains internal DC to DC converter Single Positive Supply |
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-3.0 GHz
|
||||
| 2006/05/01 | MAAD-007086-000100 | Buy | 0 | 2000 | 6 | 50 | 3.5 | 1 | 48 |
SOW24
|
Plastic Surface Mount
|
Yes
|
MAAD-007086.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
IP1dB: 24, LSB: 1.0
Vc: 5.0? RoHS* Compliant Version of AT65-0106 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOW-24 Package Tape and Reel Packaging Available Test Boards are Available Attenuation: 1 dB Steps to 50 dB 50 ohm Impedance Integral TTL Driver Low DC Power Consumption RoHS* Compliant Version of AT65-0106 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOW-24 Package Tape and Reel Packaging Available Test Boards are Available Attenuation: 1 dB Steps to 50 dB 50 ohm Impedance Integral TTL Driver Low DC Power Consumption |
AD-007086-01
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
MACOM_general.png
|
Digital Attenuator 50 dB, 6-Bit, TTL Driver, DC-2.0 GHz
|
||
| 2006/04/12 | MAAD-007082-000100 | Buy | 0 | 2400 | 6 | 50 | 4.5 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAAD-007082.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
IP1dB: 24, LSB: 1.0
Vc: 5.0 RoHS* Compliant Version of AT90-0106 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package Tape and Reel Packaging Available Test Boards are Available 50 ohm Impedance Integral TTL Driver Attenuation: 1 dB Steps to 50 dB Small Footprint, JEDEC Package Low DC Power Consumption |
AD00708201
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 50 dB, 6-Bit, TTL Driver, DC - 2.4 GHz
|
||
| 2006/03/18 | MAATSS0015 | Buy | 0 | 2000 | 4 | 15 | 2 | 1 | 50 |
SOIC16
|
MAATSS0015_SPAR.zip
|
Plastic Surface Mount
|
Yes
|
MAATSS0015.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
1-dB Attenuation Steps to 15 dB
RoHS* Compliant Version of AT-210 260°C Re-flow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOIC-16 Package Temperature Stability +/-0.15 dB: -40°C to +85°C Tape and Reel Packaging Available Low DC Power Consumption: 50 µW Low Intermodulation Product: +50 dBm IP3 High Accuracy |
soic-16.jpg
|
Digital Attenuator, 15 dB, 4-Bit DC - 2.0 GHz
|
|||
| 2006/03/03 | MAATSS0022 | Buy | 500 | 2500 | 5 | 15.5 | 1.8 | 0.5 | 46 |
MSOP-10
|
Plastic Surface Mount
|
Yes
|
MAATSS0022.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
5 Bits, 0.5 dB Steps
RoHS* Compliant 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free MSOP-10 Package Excellent Accuracy Single Positive Control (+3 V to +5 V) |
msop-10.jpg
|
Digital Attenuator, 5-Bit, 15.5 dB 500 - 2500 MHz
|
||||
| 2006/01/27 | MAATCC0011 | Buy | 0 | 4000 | 6 | 31.5 | 5.1 | 0.5 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAATCC0011.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 0.5 dB Steps to 31.5 dB
RoHS* Compliant Version of AT90-1107 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package 50 ohm Impedance Integral TTL Driver Small Footprint, JEDEC Package Low DC Power Consumption Contains internal DC to DC converter Single Positive Supply |
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 31.5 dB, 6-Bit, TTL Driver, DC-4.0 GHz
|
||||
| 2005/12/10 | AT-357-SMA | Buy | 0 | 2000 | 5 | 31 | 6.5 | 1 | 47 |
C-46
|
Connectorized
|
No
|
AT-357-SMA.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components |
No
|
Attenuation 1 dB Steps to 31 dB
Hermetic Connectorized Housing TTL Control Interface |
MACOM_general.png
|
GaAs Digital Attenuator 31 dB, 5 - Bit, DC - 2 GHz
|
||||
| 2005/11/13 | MAATCC0009 | Buy | 0 | 4000 | 6 | 31.5 | 3.4 | 0.5 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAATCC0009.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
IP1dB: 24, Vc: 5.0?
LSB: 0.5 RoHS* Compliant Version of AT90-0107 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package Tape and Reel Packaging Available Attenuation: 0.5 dB Steps to 31.5 dB Test Boards are Available 50 Ohm Impedance Integral TTL Driver Small Footprint, JEDEC Package Low DC Power Consumption |
MAATCC0009
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 31.5 dB, 6-Bit, TTL Driver, DC-4.0 GHz
|
||
| 2005/10/20 | MAADSS0018 | Buy | 2000 | 6000 | 5 | 15.5 | 2 | 0.5 | 42 |
3mm PQFN-16LD
|
Plastic Surface Mount
|
Yes
|
MAADSS0018.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
No
|
Integrated Logic
RoHS* Compliant 260°C Reflow Compatible Halogen-Free “Green” Mold Compound Lead-Free 3 mm 16-Lead PQFN Package 0.5 dB Attenuation Steps to 15.5 dB Attenuation Accuracy: 0.3 dB + 3% @ 3.4 GHz >42 dBm typical @ 2.0 GHz Insertion Loss: 2.0 dB @ 3.4 GHz Positive Single Control |
3x3 mm-16 lead PQFN.jpg
|
Digital Attenuator, 5-Bit, Single Control 15.5 dB, 2.0 - 6.0 GHz
|
||||
| 2005/11/02 | MAATCC0007 | Buy | 0 | 2000 | 5 | 31 | 2.3 | 1 | 48 |
SOW16
|
Plastic Surface Mount
|
Yes
|
MAATCC0007.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Vc: 5.0?, IP1dB: 24
LSB: 1.0 RoHS* Compliant Version of AT65-0263 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOW-16 Package Tape and Reel Packaging Available Attenuation: 1.0 dB Steps to 31 dB Test Boards are Available 50 Ohm Impedance Integral TTL Driver Plastic SOW, Wide Body, SMT Package Low DC Power Consumption |
MAATCC0007
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
SOW 16.jpg
|
Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-2.0 GHz
|
||
| 2005/10/08 | MAATCC0005 | Buy | 0 | 2000 | 6 | 31.5 | 3.1 | 0.5 | 48 |
SOW24
|
Plastic Surface Mount
|
Yes
|
MAATCC0005.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
IP1dB: 29, LSB: 0.5
Vc: 5.0? RoHS* Compliant Version of AT65-0107 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOW-24 Package Tape and Reel Packaging Available Test Boards are Available 50 Ohm Impedance Integral TTL Driver Attenuation: 0.5 dB Steps to 31.5 dB Plastic SOIC, Wide Body, SMT Package Low DC Power Consumption |
MAATCC0005
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
MACOM_general.png
|
Digital Attenuator 31.5 dB, 6-Bit, TTL Driver, DC-2.0 GHz Rev
|
||
| 2005/08/25 | MAATCC0008 | Buy | 0 | 3000 | 4 | 15 | 1.7 | 1 | 50 |
SOW16
|
Plastic Surface Mount
|
Yes
|
MAATCC0008.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 1.0 dB steps to 15 dB
RoHS* Compliant Version of AT65-0413 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOW-16 Package Temperature Stability: ±0.18 dB from –40°C to +85°C Typ. 50 Ohm Impedance Integral TTL Driver Low DC Power Consumption |
SOW 16.jpg
|
Digital Attenuator 15.0 dB, 4-Bit, TTL Driver, DC-3.0 GHz
|
||||
| 2005/08/19 | MAATSS0021 | Buy | 50 | 2000 | 5 | 15.5 | 1.5 | 0.5 | 45 |
SOIC16
|
MAATSS0021_Deembedded_Spars.zip
|
Plastic Surface Mount
|
Yes
|
MAATSS0021.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
0.5 dB Attenuation Steps to 15.5 dB
RoHS* Compliant Version of AT-280 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOIC-16 Package Temperature Stability: +/-0.15 dB from -40°C to +85°C Tape and Reel Packaging Available Low Intermodulation Product: +45 dBm IP3 Ultra Low DC Power Consumption |
soic-16.jpg
|
Digital Attenuator, 15.5 dB, 5-Bit DC - 2.0 GHz
|
|||
| 2005/08/01 | AT-232-PIN | Buy | 0 | 2000 | 4 | 30 | 2.5 | 2 | 50 |
CR-6
|
Ceramic Surface Mount
|
Yes
|
AT-232-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
Attenuation: 2 dB steps to 30 dB
RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-6 Package 50 Ohm Nominal Impedance Fast Switching Speed, 12 ns Typical Hermetic Surface Mount Package Low DC Power Consumption Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical |
CR 6.JPG
|
Digital Attenuator 30.0 dB, 4-Bit, TTL Driver, DC-2.0 GHz
|
||||
| 2005/07/24 | AT-106-PIN | Buy | 5 | 2000 | 6 | 50 | 3.2 | 1 | 46 |
CR-13
|
Ceramic Surface Mount
|
Yes
|
AT-106-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Vc: 3.5
LSB: 1 RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-13 Package 50 Ohm Nominal Impedance Integral TTL Driver Hermetic Surface Mount Package Low DC Power Consumption Attenuation: 1 dB steps to 50 dB Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical |
AT-106
|
Electrolytic gold over nickel
|
CR13.jpg
|
Digital Attenuator 50.0 dB, 6-Bit, TTL Driver, DC-2.0 GHz
|
||
| 2005/07/22 | AT-213-PIN | Buy | 5 | 3000 | 4 | 15 | 1.6 | 1 | 50 |
CR-11
|
Ceramic Surface Mount
|
Yes
|
AT-213-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
IP1dB: 28, LSB: 1.0
Vc: 3.5 260°C Reflow Compatible Lead-Free CR-11 Package 50 Ohms Nominal Impedance Integral TTL Driver Attenuation: 1 dB steps to 15 dB Hermetic Surface Mount Package Low DC Power Consumption Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical RoHS* Compliant |
CR 11.JPG
|
Digital Attenuator 15.0 dB, 4-Bit, TTL Driver, DC-3.0 GHz
|
||||
| 2005/07/27 | AT-283-PIN | Buy | 5 | 2000 | 5 | 15.5 | 2.2 | 0.5 | 47 |
CR-12
|
Ceramic Surface Mount
|
Yes
|
AT-283-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
LSB: 0.5, Vc: 3.5
IP1dB: 28 RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-12 Package 50 O Nominal Impedance Integral TTL Driver Hermetic Surface Mount Package Attenuation: 0.5 dB Steps to 15.5 dB Low DC Power Consumption Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical |
AT-283
|
Electrolytic gold over nickel
|
CR 12.JPG
|
Digital Attenuator 15.5 dB, 5-Bit, TTL Driver, DC-2.0 GHz Rev
|
||
| 2005/07/23 | AT-107-PIN | Buy | 5 | 2000 | 6 | 31.5 | 2.6 | 0.5 | 48 |
CR-13
|
Ceramic Surface Mount
|
Yes
|
AT-107-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
LSB: 0.5, IP1dB: 29
Vc: 3.5 RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-13 Package 50 Ohm Nominal Impedance Integral TTL Driver Attenuation: 0.5 dB steps to 31.5 dB Hermetic Surface Mount Package Low DC Power Consumption Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical |
AT-107
|
Electrolytic gold over nickel
|
CR13.jpg
|
Digital Attenuator 31.5 dB, 6-Bit, TTL Driver, DC-2.0 GHz
|
||
| 2005/07/25 | MAATCC0006 | Buy | 0 | 3000 | 4 | 30 | 2.6 | 2 | 50 |
SOIC16
|
Plastic Surface Mount
|
Yes
|
MAATCC0006.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
IP1dB: 28, Vc: 5.0?
LSB: 2.0 RoHS* Compliant Version of AT65-0233 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOIC-16 Package Temperature Stability: ±0.18 dB from -55°C to +85°C Typ 50 Ohm Impedance Integral TTL Driver Attenuation: 2.0 dB steps to 30 dB Low DC Power Consumption |
MAATCC0006
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
soic-16.jpg
|
Digital Attenuator 30.0 dB, 4-Bit, TTL Driver, DC-3.0 GHz
|
||
| 2005/07/18 | MAADCC0006 | Inquire | 50 | 4000 | 4 | 15 | 2.5 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAADCC0006.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1 dB Steps to 15 dB
RoHS* Compliant Version of AT90-0413 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package Tape and Reel Packaging Available Test Boards Available 50 Ohm Impedance Integral TTL Driver Small Footprint, JEDEC Package Low DC Power Consumption |
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 15.0 dB, 4-Bit, TTL Driver, DC-4.0 GHz
|
||||
| 2005/07/21 | AT-233-PIN | Buy | 5 | 2000 | 4 | 30 | 1.9 | 2 | 50 |
CR-12
|
Ceramic Surface Mount
|
Yes
|
AT-233-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
LSB: 2.0, Vc: 3.5
RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-12 Package 50 Ohm Nominal Impedance Integral TTL Driver Attenuation: 2 dB Steps to 30 dB Hermetic Surface Mount Package Low DC Power Consumption Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical |
Electrolytic gold over nickel
|
CR 12.JPG
|
Digital Attenuator 30.0 dB, 4-Bit, TTL Driver, DC-2.0 GHz
|
|||
| 2005/07/15 | AT-273-PIN | Buy | 5 | 2000 | 2 | 32 | 1.3 | 16 | 48 |
CR-11
|
Ceramic Surface Mount
|
Yes
|
AT-273-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Vc: 3.5
RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-11 Package Tape and Reel Packaging Available Temperature Stability: ±0.18 dB from -55°C to +85°C Typ 50 ohm Impedance Integral TTL Driver Hermetic Surface Mount Package Attenuation: 16.0 dB Steps to 32 dB Low DC Power Consumption |
AT-273
|
Electrolytic gold over nickel
|
CR 11.JPG
|
Digital Attenuator 32.0 dB, 2-Bit, TTL Driver, DC-2.0 GHz
|
||
| 2005/07/08 | AT-263-PIN | Buy | 5 | 2000 | 5 | 31 | 2.1 | 1 | 48 |
CR-12
|
Ceramic Surface Mount
|
Yes
|
AT-263-PIN.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
LSB: 1.0, Vc: 3.5
RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-12 Package 50 Ohm Nominal Impedance Integral TTL Driver Hermetic Surface Mount Package Low DC Power Consumption Temperature Stability: ± 0.18 dB from –55°C to +85°C Typical Attenuation: 1 dB steps to 31 dB |
Electrolytic gold over nickel
|
CR 12.JPG
|
Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-2.0 GHz
|
|||
| 2005/06/24 | MAATCC0010 | Buy | 0 | 3000 | 5 | 31 | 3.6 | 1 | 48 |
4x6mm PQFN-32LD
|
Plastic Surface Mount
|
Yes
|
MAATCC0010.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
Attenuation: 1.0 dB Steps to 31 dB
RoHS* Compliant Version of AT90-0263 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free CSP-1 Package Tape and Reel Packaging Available Test Boards are Available 50 Ohm Impedance Integral TTL Driver Small Footprint, JEDEC Package Low DC Power Consumption |
CSP 1 - 6 x 4 32 Lead.JPG
|
Digital Attenuator 31.0 dB, 5-Bit, TTL Driver, DC-3.0 GHz
|
||||
| 2005/04/09 | MAATSS0017 | Buy | 400 | 2500 | 5 | 15.5 | 2 | 0.5 | 47 |
QSOP16
|
MAATSS0017_SPAR.zip
|
Plastic Surface Mount
|
Yes
|
MAATSS0017.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola) |
No
|
5 Bits, 0.5 dB Steps
RoHS* Compliant Version of MAATSS0001 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free QSOP-16 (SSOP-16) Package Single Positive Control (+3 V to +5 V) Excellent Accuracy |
AT-0017
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
QSOP-16.jpg
|
Digital Attenuator, 5-Bit, 15.5 dB 400 - 2500 MHz
|
|
| 2005/03/01 | MAADSS0008 | Buy | 50 | 2000 | 1 | 15 | 1 | 15 | 50 |
SOT-25
|
Plastic Surface Mount
|
Yes
|
MAADSS0008.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
IP1dB: 23
Vc: 2.5 RoHS* Compliant Version of AT-267 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOT-25 Package Tape and Reel Packaging Available Single 15-dB Step 2.5 to 5.0 Volt Operation Low Loss, 0.3 dB Typical @ 900 MHz |
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
SOT 25.JPG
|
Digital Attenuator, 1-Bit, 15 dB DC - 2.0 GHz
|
|||
| 2005/02/17 | MAATSS0016 | Buy | 500 | 2000 | 4 | 30 | 2.2 | 2 | 47 |
TSSOP16
|
MAATSS0016_SPAR.zip
|
Plastic Surface Mount
|
Yes
|
MAATSS0016.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
Positive Single Control
RoHS* Compliant Version of AT-264 260°C Re-flow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free TSSOP-16 Plastic Package Low DC Power Consumption 2-dB Attenuation Steps to 30 dB |
TSSOP-16.jpg
|
Digital Attenuator, 4-Bit, Single Control 30 dB, 0.5 - 2.0 GHz
|
Yes
|
||
| 2004/12/22 | MAATSS0018 | Buy | 100 | 2000 | 1 | 10 | 0.4 | 10 | 50 |
SOT-25
|
Plastic Surface Mount
|
Yes
|
MAATSS0018.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
Vc: 3.0
IP1dB: 28 RoHS* Compliant Version of AT-266 260°C Reflow Compatible Halogen-Free “Green” Mold Compound 100% Matte Tin Plating over Copper Lead-Free SOT-25 Package Single 10 dB Step Low Loss: 0.3 dB @ 900 MHz |
54
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
SOT 25.JPG
|
Digital Attenuator, 1-Bit, 10 dB Step DC - 2.0 GHz
|
||
| 2000/08/17 | MADA2030G | Buy | 50 | 2000 | 5 | 15.5 | 1.9 | 0.5 | 45 |
DIE
|
Die/Bumped Die
|
Yes
|
MADA2030G.pdf
|
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification M513 - Tape and Reel Packaging for Surface Mount Components M541 - Bonding, Handling, and Mounting Procedures for Chip Diode Devices |
No
|
Attenuation 0.5-dB Steps to 15.5 dB
Ultra Low DC Power Consumption Fast Switching Speed: 3 nS Typical to 90% Temperature Stability: ± 0.1 dB from –55°C to +85°C Typical |
MACOM_general.png
|
5-Bit GaAs Digital Attenuator DC- 2.0 GHz
|
||||
| 2000/08/03 | AT20-0106 | Buy | 0 | 2000 | 6 | 50 | 4.6 | 1 | 46 |
CR-13
|
Ceramic Surface Mount
|
Yes
|
AT20-0106.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 1 dB steps to 50 dB
RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-13 Package 50 Ohm Nominal Impedance Low Cost/High Performance High Intercept Point Integral TTL Driver Surface Mount Package Low DC Power Consumption Temperature Stability: ± 0.18 dB from –40°C to +85°C Typical |
CR13.jpg
|
Digital Attenuator 50.0 dB, 6-Bit, TTL Driver, DC-2.0 GHz
|
||||
| 2000/07/28 | AT20-0273 | Buy | 0 | 2000 | 2 | 32 | 1.9 | 16 | 48 |
CR-11
|
Ceramic Surface Mount
|
Yes
|
AT20-0273.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 16 dB steps to 32 dB • • • • • • • • •
RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-11 Package 50 Ohm Nominal Impedance Low Cost/High Performance Integral TTL Driver Surface Mount Package Low DC Power Consumption Temperature Stability: ± 0.18 dB from –40°C to +85°C Typical |
CR 11.JPG
|
Digital Attenuator 32.0 dB, 2-Bit, TTL Driver, DC-2.0 GHz
|
||||
| 2000/07/22 | AT20-0107 | Buy | 0 | 2000 | 6 | 31.5 | 3.8 | 0.5 | 48 |
CR-13
|
Ceramic Surface Mount
|
Yes
|
AT20-0107.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: 0.5 dB Steps to 31.5 dB1
RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-13 Package Low Cost/High Performance High Intercept Point Integral TTL Driver Surface Mount Package Low DC Power Consumption Temperature Stability: ±0.18 dB from –40ºC to +85ºC Typ |
CR13.jpg
|
Digital Attenuator 31.5 dB, 6-Bit, TTL Driver, DC-2.0 GHz
|
||||
| 2000/07/23 | AT20-0263 | Buy | 5 | 2000 | 5 | 31 | 2.1 | 1 | 48 |
CR-12
|
Ceramic Surface Mount
|
Yes
|
AT20-0263.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
IP1dB: 28, LSB: 1.0
Vc: 5.0 RoHS* Compliant 260°C Reflow Compatible Lead-Free CR-12 Package 50 Ohm Nominal Impedance Attenuation: 1 dB steps to 31 dB Low Cost/High Performance Integral TTL Driver Surface Mount Package Low DC Power Consumption Temperature Stability: ± 0.18 dB from –40°C to +85°C Typical |
AT20-0263
|
Electrolytic gold over nickel
|
MACOM_general.png
|
Digital Attenuator 31dB, 5-Bit, TTL Driver, DC - 2 GHz
|
Yes
|
|
| MAAD-008866 | Buy | 5 | 1000 | 6 | 31.5 | 1.6 | 0.5 | 45 |
4mm PQFN-24LD
|
MAAD-008866_Sparms.zip
|
Plastic Surface Mount
|
Yes
|
MAAD-008866.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
|
75 Ohm Impedance
0.5-dB Attenuation Steps to 31.5 dB RoHS* Compliant 260°C Re-flow Compatible Halogen-Free “Green” Mold Compound Lead-Free 4mm PQFN-24LD Plastic Package Low DC Power Consumption Parallel & Serial (P/S) Control with power-up state selection Integrated TTL/CMOS Compatible Driver |
V011
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
4x4_24-lead PQFN.jpg
|
75 Ohm Digital Attenuator, 6-Bit, Serial / Parallel Control 31.5 dB, 0.005 - 1.0 GHz
|
Yes
|
|
| MAAD-009260-000100 | Buy | 50 | 3000 | 2 | 32 | 2.7 | 16 | 42 |
CR-12
|
Ceramic Surface Mount
|
Yes
|
MAAD-009260.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
Yes
|
Attenuation: Two 16 dB bits
RoHS* Compliant 260°C Reflow Compatible 50 Ohm Nominal Impedance Integral TTL Driver Hermetic Surface Mount Package Low DC Power Consumption Minimal Phase Variation over Attenuation Range |
CR 12.JPG
|
Constant Phase Digital Attenuator 32 dB, 2-Bit, TTL Driver, DC-3.0 GHz Rev
|
|||||
| MAAD-010305 | Inquire | 5 | 1100 | 1 | 15.1 | 0.3 | 15 | 46 |
SOT-25
|
MAAD-010305 Sparms.zip
|
Surface Mount
|
Yes
|
MAAD-010305.pdf
|
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components M538 - Surfacing Mounting Instructions - Footprint Guidelines S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices |
No
|
Single 15-dB Step
RoHS Compliant 260°C Reflow Compatible Halogen-Free “Green” Mold Compound Lead-Free SOT-25 Package Positive or Negative Voltage Control 2.5 to 5.0 Volt Operation 75 ohm Impedance Insertion Loss: 0.3 dB @ 1.1 GHz |
81
|
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
|
SOT 25.JPG
|
Digital Attenuator, 1-Bit, 15 dB, 75 Ohm DC - 1.1 GHz
|
||
| MAAD-000523 | Inquire | 700 | 6000 | 6 | 31.5 | 1.9 | 0.5 | 52 |
4mm PQFN-24LD
|
MAAD-000523_SN2_spar.zip
|
Plastic Surface Mount
|
Yes
|
MAAD-000523.pdf
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AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices S2083 - Surface Mounting Instructions for PQFN Packages |
Yes
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Integrated CMOS/TTL Compatible Driver
Small Relative Phase Variation per Bit 260°C Re-flow Compatible RoHS* Compliant Halogen-Free “Green” Mold Compound Lead-Free 4 mm 24-Lead PQFN Package Useable from 0.4 to 8.0 GHz 0.5-dB Attenuation Steps to 31.5 dB Attenuation Accuracy: +/-(0.4 + 4% of attenuation setting) dB 50 dBm typical @ 2 GHz Insertion Loss: 1.6 dB typical @ 2.1 GHz Parallel & Serial (P/S) Control with power-up state selection |
V018
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100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
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4x4_24-lead PQFN.jpg
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Digital Attenuator, 6-Bit, Serial / Parallel Control 31.5 dB, 0.7 - 6.0 GHz
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