放大器增益模块

放大器增益模块

MACOM公司设计、制造多种适合射频、微波、毫米波应用的放大器增益模块并提供相关支持。我们的放大器增益模块覆盖DC到45 GHz的频率范围。MACOM公司的增益模块可用于多种50欧姆和75欧姆应用,其中包括网络、商业、航空航天以及军事领域。这些产品采用最新的创新型技术,可以采用标准塑料封装和裸片形式。

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部件号 订货 描述 最低频率(MHz) 最高频率(MHz) 增益(dB) 输出P1dB (dBm) OIP3 (dBm) 偏置电流(mA) 封装 产品照片 NF (dB) 75欧姆 封装类别 Rohs 无铅 硬件手册 模型数据(Sparameters) 应用笔记 特性 标志 引线精加工 兼容部件 偏置电压(V) Brightcove视频 ADS & SPICE模型信息 Xmicrowave图片 Xmicrowave URL
 
 
 
 
 
 
 
 
MAAM-011132 询问 Driver Amplifier 17.7 - 23.6 GHz
17700 23600 23 21 33 180 4mm PQFN-16LD
4x4 mm-16 lead PQFN.jpg
No
QFN
Yes
Yes
MAAM-011132.pdf
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
3 Stage Driver Amplifier for 18/23 GHz Bands
Variable Gain with Adjustable Bias
21 dBm Output P1dB
33 dBm Output Third Order Intercept (OIP3)
23 dB Gain
RoHS* Compliant
MAAM-011132.zip
MAAM-011101 询问 Ultra small Broadband General Purpose Amplifier 4 - 20 GHz
4000 20000 16 19 30 45 1.5X1.2mm TDFN-6LD
1-2_x_1-5mm_6-lead.jpg
4 No
Plastic Surface Mount
Yes
Yes
MAAM-011101.pdf
MAAM-011101_sparameters_8V_25C.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Gain: 16 dB
RoHS* Compliant
Halogen-Free “Green” Mold Compound
Lead-Free 1.5 x 1.2 mm 6-Lead TDFN package
Single DC supply, +5 V to +12 V, 45 mA
+18 dBm @ 14 GHz
50 O match in and out
Flatness: ± 2 dB
260°C Reflow Compatible
45
100% matte tin plate followed by a post0plate annealing operation of 1 hr at 150C
8 3203526280001
Xmicrowave.png
http://www.xmicrowave.com/product/xm-a345-0404d/
MAAMSS0045 询问 High Dynamic Range Low Noise Amplifier 1400 - 2000 MHz
1400 2000 14 16 29 45 SOIC8EP
soic-8.jpg
1.4 No
Plastic Surface Mount
Yes
Yes
MAAMSS0045.pdf
MAAMSS0045_Sparameters.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Low Noise Figure: 1.4 dB
RoHS* Compliant Version of AM50-0004
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOIC-8 Package
Single Supply: +3 to +8 VDC
High Gain: 14 dB
+8 dBm at 3 V, 20 mA bias
High Input IP3: +18 dBm at 8 V, 45 mA bias
260°C Reflow Compatible
Adjustable current: 20 to 60 mA with external resistor
5
MAAM02350-A2 采购 Wide Band GaAs MMIC Amplifier 0.2 - 3.0 GHz
200 3000 18 14 24 65 CR-3
MACOM_general.png
4 No
Ceramic Surface Mount
Yes
Yes
MAAM02350-A2.pdf
MAAM02350spar.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
High Gain: 18 dB
RoHS* Compliant
Lead-Free 8-lead Ceramic Package
Gain Flatness: ± 0.75 dB
Single Supply: +6 V
Noise Figure: 4 dB
Output Power: +14 dBm
260°C Reflow Compatible
Lead frame, base plate and external metallization: gold plate .000050 to .000225 thick per MIL-G-45204, type III, grade A. over electrolytic nickel plate .000075 to .000225 thick per QQ-N-290.
6
MAAM28000 采购 Wide Band GaAs MMIC Amplifier 2.0 - 8.0 GHz
2000 8000 17 14 24 60 DIE
MACOM_general.png
4.5 No
Die/Bumped Die
Yes
Yes
MAAM28000.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
18 dB Typical Gain
DC Decoupled RF Input and Output
Single Bias Supply: +10 V
± 0.5 dB Typical Broadband Gain Flatness
28000
10
MAAM28000-A1G 采购 Wide Band GaAs MMIC
2000 8000 17 14 24 70 CR-10
MACOM_general.png
5.5 No
Ceramic Surface Mount
Yes
Yes
MAAM28000-A1.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Gain: 17 dB (Typ.)
260°C Reflow Compatible
RoHS* Compliant
Lead-Free 8-Lead Ceramic Package
DC Decoupled RF Input and Output
No External Components Required
Single Supply: +10 V
Broadband Gain Flatness: ± 0.5 dB (Typ.)
gold plate .000050 to .000225 thick per MIL-G-45204, type III, grade A. over electrolytic nickel plate .000075 to .000225 thick per QQ-N-290.
10
MAAM28000-A1 采购 Wide Band GaAs MMIC Amplifier 2.0 - 8.0 GHz
2000 8000 17 14 24 70 CR-3
MACOM_general.png
5.5 No
Ceramic Surface Mount
Yes
Yes
MAAM28000-A1.pdf
MAAM28000-A1_SPARS_ROOM.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Gain: 17 dB Typical
RoHS* Compliant
Lead-Free 8-Lead Ceramic Package
DC Decoupled RF Input and Output
No External Components Required
Broadband Gain Flatness: ± 0.5 dB (Typ.)
260°C Reflow Compatible
Single Supply: +10 V
AM28000-A1
Lead frame, base plate and external metallization: gold plate .000050 to .000225 thick per MIL-G-45204, type III, grade A. over electrolytic nickel plate .000075 to .000225 thick per QQ-N-290.
10
MAAM02350 采购 Wide Band GaAs MMIC Amplifier 0.2 - 3.0 GHz
200 3000 17 14 24 65 DIE
MACOM_general.png
3.7 No
Die/Bumped Die
Yes
Yes
MAAM02350.pdf
MAAM02350.zip
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
High Gain: 19 dB (Typ.)
RoHS* Compliant
Noise Figure: 3.7 dB (Typ.)
Output Power: +14 dBm (Typ.)
6
XB1004-BD 询问 Buffer Amplifier 16.0-30.0 GHz
16000 30000 21 19 29 100 DIE
MACOM_general.png
2.2 No
Die/Bumped Die
Yes
Yes
XB1004-BD-MACOMTech.pdf
xb1004_sparm.zip
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
High Dynamic Range
RoHS* Compliant
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF, DC and Noise Figure Testing
+19.0 dBm P1dB Compression Point at Power Bias
2.2 dB Noise Figure at Low Noise Bias
21.0 dB Small Signal Gain
Low Noise or Power Bias Configurations
Excellent LO Driver/Buffer Amplifier
260°C Reflow Compatible
4
XB1006-BD 询问 Buffer Amplifier 18.0-38.0 GHz
18000 38000 21 15 25 25 DIE
MACOM_general.png
3.2 No
Die
Yes
Yes
XB1006-BD.pdf
XB1006-BD.zip
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
High Dynamic Range/Positive Gain Slope
RoHS* Compliant
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF, DC and Noise Figure Testing
+15 dBm P1dB Compression Point at Power Bias
3.2 dB Noise Figure at Low Noise Bias
21.0 dB Small Signal Gain
Low Noise or Power Bias Configurations
Excellent LO Driver/Buffer Amplifier
260°C Reflow Compatible
4
XB1007-BD 询问 Buffer Amplifier 4.0-11.0 GHz
4000 11000 23.5 20 30 130 DIE
MACOM_general.png
4.5 No
Die/Bumped Die
Yes
Yes
XB1007-BD.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Excellent Transmit LO/Output Buffer Stage
RoHS* Compliant
100% Commercial-Level Visual Inspection Using Mil-Std-883 Method 2010
100% On-Wafer RF, DC and Output Power Testing
Variable Gain with Adjustable Bias
4.5 dB Noise Figure
23.0 dB Small Signal Gain
Compact Size
+20.0 dBm P1dB Compression Point
260°C Reflow Compatible
5
XB1005-BD 询问 Buffer Amplifier 35.0-45.0 GHz
35000 45000 23 16 26 50 DIE
MACOM_general.png
2.7 No
Die/Bumped Die
Yes
Yes
XB1005-BD.pdf
XB1005-BD.zip
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
High Dynamic Range
RoHS* Compliant
100% Commercial-Level Visual Inspection Using Mil-Std-883 Method 2010
Wafer RF, DC and Noise Figure Testing
+16 dBm P1dB Compression at Power Bias ? 100% On
2.7 dB Noise Figure at Low Noise Bias
23.0 dB Small Signal Gain
Low Noise or Power Bias Configurations
Excellent LO Driver/Buffer Amplifier
260°C Reflow Compatible
4
XB1008-BD 询问 Buffer Amplifier 10.0-21.0 GHz
10000 21000 18 20 30 130 DIE
MACOM_general.png
5.1 No
Die/Bumped Die
Yes
Yes
XB1008-BD-MACOMTech.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Excellent Transmit LO/Output Buffer Stage ? Compact Size ? 18.0 dB Small Signal Gain ? ? ? ? ? ?
RoHS* Compliant
100% Commercial-Level Visual Inspection Using Mil-Std-883 Method 2010
100% On-Wafer RF, DC & Output Power Testing
Variable Gain with Adjustable Bias
5.5 dB Noise Figure
+20.0 dBm P1dB Compression Point
260°C Reflow Compatible
4
XB1008-QT 询问 Buffer Amplifier 10.0-21.0 GHz
10000 21000 17 18 32 100 3mm PQFN-16LD
3x3_mm-16_lead_PQFN.jpg
4.5 No
Plastic Surface Mount
Yes
Yes
XB1008-QT.pdf
XB1008-QT.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Excellent Transmit LO/Output Buffer Stage
RoHS* Compliant x
100% RF, DC and Output Power Testing
Variable Gain with Adjustable Bias
4.5 dB Noise Figure
+32 dBm Output IP3
+20.0 dBm Psat
3x3mm, QFN
260°C Reflow Compatible
17.0 dB Small Signal Gain
B1008QT
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
4
MAAM-009560 询问 RF Driver Amplifier 250 - 4000 MHz
250 4000 15 29 42 225 SOT-89
SOT-89.jpg
3 No
Plastic Surface Mount
Yes
Yes
MAAM-009560.pdf
MAAM009560_DEEMBEDDED_SPAR_S2P.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Output Intercept Point of +42 dBm over a 20 dB Input Power Range
Class 2 ESD Rating
RoHS* Compliant
Halogen-Free “Green” Mold Compound
Lead-Free SOT-89 Package
Broadband Operation
260°C Reflow Compatible
34
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
5
XB1007-QT 询问 4.0-11.0 GHz GaAs MMICBuffer Amplifier, QFNExcellent
4000 11000 23 19 31 100 3mm PQFN-16LD
3x3mm_PQFN_16-lead.jpg
5 No
Plastic Surface Mount
Yes
No
XB1007-QT.pdf
XB1007-QT.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Excellent Transmit LO/Output Buffer StagE
Variable Gain with Adjustable Bias
4.5 dB Noise Figure
+19.0 dBm P1dB Compression Point
23.0 dB Small Signal Gain
3x3mm, QFN
100% RF, DC and Output Power
B1007
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
4
XB1014-QT 询问 Buffer Amplifier 37.0 - 40.0 GHz
37000 40000 21 20 30.5 63 3mm PQFN-16LD
3x3mm_PQFN_16-lead.jpg
No
Plastic Surface Mount
Yes
No
XB1014-QT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
21.0 dB Small Signal Gain
RoHS* Compliant
100% RF, DC and Output Power Testing
Lead-free 3 mm 16-lead PQFN Package
Variable Gain with Adjustable Bias
+30.5 dBm Output IP3
+20.0 dBm P1dB
+22.0 dBm Psat
260°C Reflow Compatible
B1014-QT
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
4
MAAM-009286 询问 RF Driver Amplifier 250 - 4000 MHz
250 4000 15.5 27 42 155 SOT-89
SOT-89.jpg
3.5 No
Plastic Surface Mount
Yes
Yes
MAAM-009286.pdf
MAAM009286__DEEMBEDDED_SPAR_S2P.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
+42 dBm Output IP3
Broadband Operation
Lead-Free SOT-89 Package
Halogen-Free “Green” Mold Compound
RoHS* Compliant
Class 2 ESD Rating
260°C Reflow Compatible
32
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
5
CMM0511-QT 询问 5.0-14.0 GHz GaAs MMIC Packaged Driver Amplifier
5000 14000 20 11 22 90 3mm PQFN-16LD
3x3mm_PQFN_16-lead.jpg
7 No
Plastic Surface Mount
Yes
Yes
CMM0511-QT.pdf
CMM0511-QT.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
20 dB Gain
On-Chip ESD Protection
5-7 V, 90 mA Self Bias
Single Power Supply
3 x 3 QFN Package
11 dBm P1dB
5
XF1001-SC 询问 10DC-6.0 GHz1.0W Packaged HFETPage
0 6000 15.5 30 46.5 300 SOT-89
SOT-89.jpg
4.5 No
Plastic Surface Mount
Yes
Yes
XF1001-SC.pdf
XF1001-SC.zip
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
46.5 dBm OIP3 @ 5.8 GHz
SOT-89 Package
30.0 dBm P1dB
10.0 dB Gain @ 6 GHz
15.5 dB Gain @ 2 GHz
8
MAAM-010513 询问 40.5 - 43.5 GHz, Amplifier, Driver
40500 43500 23 23 32 400 5mm LGA-12LD
MACOM_general.png
No
Laminate Surface Mount
Yes
Yes
MAAM-010513.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Gain: 23 dB
P1dB: 23 dBm
OIP3: 32 dBm
Variable Gain with Adjustable Bias
Lead-Free 5 mm Laminate Package
RoHS* Compliant
260°C Reflow Compatible
AM010513
Electrolytic gold over nickel
4
MAAM-011112 询问 Buffer Amplifier 20 – 37 GHz
20000 37000 24 18 30 335 3mm PQFN-16LD
3x3 mm-16 lead PQFN.jpg
6.5 No
Plastic Surface Mount
Yes
Yes
MAAM-011112.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Wide Bandwidth
RoHS* Compliant
Lead-Free 3 mm 16-Lead PQFN Package
+4V Bias Supply
30 dBm IP3
20 dBm Output Power
24 dB Gain
260°C Reflow Compatible
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
4
MAAM-008198-00A162 询问 Cascadable Amplifier 10 to 1200 MHz
10 1200 13 6 18 15 TO-8
MACOM_general.png
3.5 No
Hermetic
Yes
Yes
MAAM-008198-00A162.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
AN215a - RF Small Signal Design Using Two-Port Parameters (supplied with the permission of Motorola)
Low Noise: 3.5 dB (Typ.)
Low VSWR: <1.5:1 (Typ.)
Good Dynamic Range: 102.5 dB (Typ.) in 1 MHz BW
High Efficiency: 15 mA (Typ.) @ +5 Volts
5
MAAM-011206 询问 Broadband Darlington Amplifier DC-15 GHz
0 15000 13.5 18 29 72 1.5 x 1.2 mm 6-lead TDFN Plastic Package
1.2x1.5mm_6-lead.jpg
4.5 No
DFN Plastic Package
Yes
Yes
MAAM-011206.pdf
MAAM_011206_PoB_01_VD5_RB4000_ID72mA_ds.s2p
Gain: 13.5 dB @ 6 GHz
Halogen–Free “Green” Mold Compound
Lead-Free 1.5 x 1.2 mm 6-lead TDFN Plastic Package
Adjustable Current
Single Bias Operation
Noise figure: 4.5 dB @ 6 GHz
Output P1dB: 18 dBm @ 6 GHz
RoHS* Compliant
5430190225001
Xmicrowave.png
http://www.xmicrowave.com/product/xm-a4d6-0404d/
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