倍频器

倍频器

MACOM公司提供一系列可用于各种通信应用的倍频器产品。我们的倍频器产品由有源二倍频器和输出缓冲放大器组成,可以在一定输入功率范围内提供恒定输出功率,从而能够很好地抑制基波和谐波。MACOM可以提供裸片或表面贴装无铅QFN封装的倍频器。

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部件号 订货 描述 Min Input Frequency (MHz) Max Input Frequency (MHz) Min Output Frequency (MHz) Max Output Frequency (MHz) Input Power (dBm) Mulitply Factor Conversion Loss (dB) 封装 优势 最低频率(MHz) VSWR Power, Maximum (W) Bias Max Vtune Min Vtune Phase Noise 10KHz Pout at RF Pout at RF/2 封装类别 ROHS 无铅 硬件手册 模型数据(Sparameters) 应用笔记 特性 最高频率(MHz) 标志 引线精加工 兼容部件 产品照片 MSL ESD 产品介绍 产品公告 外形图 质量报告 Brightcove视频 ADS & SPICE模型信息 数据手册封装概述 设备固件 EVM GUI软件 EVM用户手册 目录 Xmicrowave URL Xmicrowave Image Output Power (dBm)
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
MAFC-004403 询问 Frequency Doubler 16 - 24 GHz Output
8000 12000 16000 24000 0 2 12 4mm PQFN-16LD
16000 17 Plastic Surface Mount
Yes
MAFC-004403.pdf
S2083 - Surface Mounting Instructions for PQFN Packages
16 - 24 GHz Output Frequency Range
Lead-Free 4 mm, 16-Lead QFN Package
260°C Reflow Compatible
RoHS* Compliant
High Dynamic Range
High 1xFIN and 3xFIN Suppression
17 dBm Output Power
24000 4x4mm-16 lead PQFN.jpg
17
MAFC-010511 询问 Frequency Doubler 16 - 24 GHz Output
8000 12000 16000 24000 0 2 17 3mm PQFN-16LD
Plastic Surface Mount
Yes
MAFC-010511.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
16 - 24 GHz Output Frequency Range
RoHS* Compliant
260°C Reflow Compatible
Lead-Free 3 mm, 16-Lead QFN Packag3
High Dynamic Range
High 1xFIN and 3xFIN Suppression
17 dBm Output Power
3x3 mm-16 lead PQFN.jpg
FM-107-PIN 询问 Broadband Frequency Doubler, 10—4800 MHz Output
5 2400 10 4800 10 2 11 FP-2
10 1.5 0.3 Ceramic Surface Mount
No
FM-107_FM-108_FMS-109.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
Operates Over Full AMPS/PCN PCS/PHS Band
High Fundamental and Third Order Suppression
Typical Midband VSWR 1.5:1
Two Hermetic Package Options
Low Conversion Loss
4800 MACOM_general.png
FMS-109-PIN 采购 Broadband Frequency Doubler, 10—4800 MHz Output
5 2400 10 4800 10 2 11 SF-1
10 1.5 0.3 Ceramic Surface Mount
No
FM-107_-108_FMS-109.pdf
AN3009 - S-Parameter S2P File Format Guide
Operates Over Full AMPS/PCN PCS/PHS Bands n Low Conversion Loss
High Fundamental and Third Order Suppression
Typical Midband VSWR 1.5:1
Two Hermetic Package Options
4800 MACOM_general.png
FM-104-PIN 采购 Broadband Frequency Doubler, 150 - 3000 MHz Output
75 1500 150 3000 24 2 10 FP-3
150 2.5 0.3 Ceramic Surface Mount
No
FM-104.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
Hermetic Flatpack
MIL-STD-202 Screening Available
Maximum Input Power: 300 mW Max.
50 Ohms Nominal
Conversion Loss: 10 dB Midband
Multioctave Frequency Coverage
3000 FP 3.JPG
FM-105-PIN 采购 Plug-In Frequency Doubler, 20 - 1500 MHz Output
10 750 20 1500 24 2 12 RH-3
20 2 0.3 Through Hole/Solderwave
No
FM-105.pdf
AN3009 - S-Parameter S2P File Format Guide
Relay Header Case
MIL-STD-883 Screening Available
Maximum Input Power: 300 mW Max.
50 Ohms Nominal
Conversion Loss: 12 dB Midband
Multioctave Frequency Coverage
1500 MACOM_general.png
FDZ5013 询问 Frequency Doubler
3000 12000 6000 24000 13 2 12 Versapac
3000 2 0.02 Hermetic
No
FDZ5013.pdf
AN3009 - S-Parameter S2P File Format Guide
Input 3 to 12 GHz
Hermetically-Sealed Package
Input Drive Level +13 dBm (nominal)
Output 6 to 24 GHz
12000 MACOM_general.png
CSFD25H 询问 (non-RoHS) Frequency Doubler
10 2400 20 4800 23 2 12 SMT
10 2 0.01 Plastic Surface Mount
No
CSFD25H.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input: 10 to 2400 MHz
Surface Mount
Input Drive Level +23 dBm (Nominal)
Output: 20 to 4800 MHz
2400 MACOM_general.png
http://www.xmicrowave.com/product/xm-a4d5-0604d/
Xmicrowave.png
FD26C 询问 Frequency Doubler
50 3300 100 6600 10 2 13 Connectorized-SMA
50 2 0.01 Connectorized
No
FD26.pdf
AN3009 - S-Parameter S2P File Format Guide
Input Frequency 50 to 3300 MHz
Hermetically-Sealed Package
Input Drive Level: +10 dBm (Nominal)
Output: 100 to 6600 MHz
3300 MACOM_general.png
CSFD26 采购 Low Cost Frequency Doubler
50 3300 100 6600 10 2 13.5 SMT
50 2 0.01 Plastic Surface Mount
No
CSFD26.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input Frequency 50 to 3300 MHz
Surface Mount
Input Drive +10 dBm (Nominal)
Output Frequency 100 to 6600 MHz
3300 MACOM_general.png
http://www.xmicrowave.com/product/xm-a4a1-0604d/
Xmicrowave.png
SFD26 采购 Frequency Doubler
50 3300 100 6600 10 2 13 SMT
50 2 0.01 Hermetic
No
FD26.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input: 50 to 3300 MHz
Hermetically-Sealed Package
Input Drive level +10 dBm (Nominal)
Output: 100 to 6600 MHz
3300 MACOM_general.png
http://www.xmicrowave.com/product/xm-a4d3-0604d/
Xmicrowave.png
FD93 采购 Frequency Doubler
2000 9000 4000 18000 12 2 12 Versapac
2000 1.5 0.02 Hermetic
No
FD93.pdf
AN3009 - S-Parameter S2P File Format Guide
Input: 2 to 9 GHz
Hermetically-Sealed Package
Input Drive Level: +12 dBm (Nominal)
Output: 4 to 18 GHz
9000 MACOM_general.png
FD93C 采购 Frequency Doubler
2000 9000 4000 18000 12 2 12 Connectorized-SMA
2000 1.5 0.08 Connectorized
No
FD93C.pdf
AN3009 - S-Parameter S2P File Format Guide
Input: 2 to 9 GHz
Input Drive Level +12 dBm (Nominal)
Output: 4 to 18 GHZ
Hermetically-Sealed Package
9000 MACOM_general.png
FDC2310 采购 Open Carrier Frequency Doubler For Microwave Telecommunications
1500 8000 3000 16000 10 2 11 Open Carrier
1500 2 Open Carrier
No
FDC2310.pdf
AN3009 - S-Parameter S2P File Format Guide
Input Frequency 1.5 to 8.0 GHz
Microstrip Interface
Input Drive Level +10 dBm (nominal)
Output Frequency 3.0 to 16.0 GHz
8000 MACOM_general.png
FD93H 采购 Frequency Doubler
2000 9000 4000 18000 19 2 12 Versapac
2000 1.5 0.08 Hermetic
No
FD93H.pdf
AN3009 - S-Parameter S2P File Format Guide
Input: 2 to 9 GHz
Hermetically-Sealed Package
Input Drive Level: +19 dBm (NOMINAL)
Output: 4 TO 18 GHz
9000 MACOM_general.png
FD93HC 采购 Frequency Doubler
2000 9000 4000 18000 19 2 12 Connectorized-SMA
2000 1.5 0.08 Connectorized
No
FD93HC.pdf
AN3009 - S-Parameter S2P File Format Guide
Input: 2 to 9 GHz
Hermetically-Sealed Package
Input Drive Level: +19 dBm (Nominal)
Output: 4 to 18 GHz
9000 MACOM_general.png
SFD25H 采购 Frequency Doubler
5 2400 10 4800 23 2 12 SMT
5 1.5 0.2 Hermetic
No
FD25H_FD25HC_SFD25H.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input: 5 to 2400 MHz
Hermetically-Sealed Package
Input Drive Level: +23 dBm (NOMINAL)
Output: 10 to 4800 MHz
2400 MACOM_general.png
http://www.xmicrowave.com/product/xm-a4d2-0604d/
Xmicrowave.png
CSFD25 采购 Low Cost Frequency Doubler
10 2400 20 4800 10 2 11.5 SMT
2 0.01 Plastic Surface Mount
No
CSFD25.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input: 10 to 2400 MHz
Surface Mount
Input Drive level +10 dBm (Nominal)
Output: 20 to 4800 MHz
MACOM_general.png
http://www.xmicrowave.com/product/xm-a4d4-0604d/
Xmicrowave.png
FD25 采购 Frequency Doubler
5 2400 10 4800 10 2 11.5 TO-8
5 1.5 0.01 Hermetic
No
FD25_FD25C_FD25E_SFD25.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
Input 5 to 2400 MHz
Hermetically-Sealed Package
Input Drive level +10 dBm (Nominal)
Output 10 to 4800 MHz
2400 MACOM_general.png
FDC2710 采购 Open Carrier Frequency Doubler For Microwave Telecommunications
3500 8000 7000 16000 10 2 11.2 Open Carrier
3500 2 Open Carrier
No
FDC2710.pdf
AN3009 - S-Parameter S2P File Format Guide
Input: 3.5 to 8.0 GHz
Microstrip Interface
Input Drive Level: +10 dBm (NOMINAL)
Output:7.0 to 16.0 GHz
8000 MACOM_general.png
FD25C 采购 Frequency Doubler
5 2400 10 4800 10 2 11.5 Connectorized-SMA
5 1.5 0.01 Connectorized
No
FD25_FD25C_FD25E_SFD25.pdf
AN3009 - S-Parameter S2P File Format Guide
Input 5 to 2400 MHz
Hermetically-Sealed Package
Input Drive level +10 dBm (Nominal)
Output 10 to 4800 MHz
2400 MACOM_general.png
FD25H 采购 Frequency Doubler
5 2400 10 4800 23 2 12 TO-8
5 1.5 0.2 Hermetic
No
FD25H_FD25HC_SFD25H.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
Input 5 to 2400 MHz
Input Drive Level +23 dBm (nominal)
Output: 10 to 4800 MHz
Hermetically-Sealed Package
2400 MACOM_general.png
FD25E 采购 Frequency Doubler
5 2400 10 4800 10 2 11.5 Flatpack-SMT
5 1.5 0.01 Ceramic Surface Mount
No
FD25_FD25C_FD25E_SFD25.pdf
AN3009 - S-Parameter S2P File Format Guide
Input 5 to 2400 MHz
Hermetically-Sealed Package
Input Drive level +10 dBm (Nominal)
Output 10 to 4800 MHz
2400 MACOM_general.png
FD25HC 询问 Frequency Doubler
5 2400 10 4800 23 2 12 Connectorized-SMA
5 1.5 0.2 Connectorized
No
FD25H_FD25HC_SFD25H.pdf
AN3009 - S-Parameter S2P File Format Guide
Input 5 to 2400 MHz
Hermetically-Sealed Package
Input Drive Level: +23 dBm (Nominal)
Output: 10 to 4800 MHz
2400 MACOM_general.png
FDZ5013C 询问 Frequency Doubler
3000 12000 6000 24000 13 2 12 Connectorized-SMA
3000 2 0.02 Connectorized
No
FDZ5013C.pdf
AN3009 - S-Parameter S2P File Format Guide
Input 3 to 12 GHz
Hermetically-Sealed Package
Input Drive Level +13 dBm (Nominal)
Output 6 to 24 GHz
12000 MACOM_general.png
SFD25 采购 Frequency Doubler
10 2400 20 4800 10 2 11.5 SMT
5 1.5 0.01 Hermetic
No
FD25_FD25C_FD25E_SFD25.pdf
AN3009 - S-Parameter S2P File Format Guide
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input 5 to 2400 MH
Hermetically-Sealed Package
Input Drive level +10 dBm (nominal)
Output 10 to 4800 MHz
2400 MACOM_general.png
http://www.xmicrowave.com/product/xm-a4d1-0604d/
Xmicrowave.png
XX1000-QT 询问 Doubler and Power Amplifier 7.5 --22.5/15-45 GHz
7500 22500 15000 45000 0 2 3mm PQFN-16LD
Plastic Surface Mount
Yes
XX1000-QT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
Integrated Doubler and Power Amplifier
RoHS* Compliant
260°C Reflow Compatible
50.0 dBc Fundamental Suppression
+18.0 dBm Output Power
3X3mm QFN plastic package
X1000
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
3x3 mm-16 lead PQFN.jpg
18
XX1007-BD 询问 Doubler 13.5-17.0/27.0-34.0 GHz
13500 17000 27000 34000 8 2 DIE
13500 40 34000 27000 Die
Yes
XX1007-BD-MACOMTech.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
Integrated Gain, Doubler and Driver Stages
RoHS* Compliant
260°C Reflow Compatible
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF, DC & Output Power Testing
On-Chip ESD Protection
40.0 dBc Fundamental Suppression
+21.0 dBm Output Saturated Power
Self-biased Architecture
17000 MACOM_general.png
21
XX1000-BD 询问 Active Doubler 7.5-25.0/15.0-50.0 GHz
7500 25000 15000 50000 0 2 DIE
20 50000 15000 Die
Yes
XX1000-BD.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
Excellent Broadband Mixer Driver
RoHS* Compliant
260°C Reflow Compatible
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF, DC and Output Power Testing
+15 dBm Output Drive
Excellent LO Driver for MACOM Receivers
Single Ended Fed Doubler with Distributed Buffer Amplifier
MACOM_general.png
13
XX1007-QT 询问 Doubler 13.5-17.0/27.0-34.0 GHz
13500 17000 27000 34000 8 2 3mm PQFN-16LD
13500 35 34000 27000 Plastic Surface Mount
Yes
XX1007-QT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
Integrated Gain, Doubler and Driver Stages
RoHS* Compliant
260°C Reflow Compatible
3x3mm QFN Package
100% RF, DC and Output Power Testing
On-Chip ESD Protection
35.0 dBc Fundamental Suppression
+20.0 dBm Output Saturated Power
Integrated Bypassing Capacitor
Single Positive Supply, +5V
17000 XX1007-QT
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
3x3 mm-16 lead PQFN.jpg
20
XX1002-QH 询问 Active Doubler 2.5 - 6.0 / 5.0 - 12.0 GHz
2500 6000 5000 12000 0 2 4mm PQFN-24LD
2500 35 12000 5000 Plastic Surface Mount
No
XX1002-QH.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
Octave Bandwidth Operation
RoHS* Compliant
260°C Reflow Compatible
100% RF, DC and Output Power Testing
Lead-Free 4 mm 24-lead QFN Package
+5 V, 125 mA Bias
-35 dBc Fundamental Leakage
+16 dBm Output Power
6000 X1002QHP
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
4x4_24-lead PQFN.jpg
http://www.xmicrowave.com/product/xm-a4c6-0404d/
Xmicrowave.png
16
FD26 询问 Frequency Doubler
50 3300 100 6600 10 2 13 TO-8
50 2 0.01 Hermetic
No
FD26.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
Input: 50 TO 3300 MHz
Output: 100 TO 6600 MHz
Input Drive Level +10 dBm (nominal)
Hermetically-Sealed Packaged
3300 MACOM_general.png
XX1010-QT 询问 Doubler 14.625-15.0/29.25-30 GHz
14625 15000 29250 30000 3 2 3mm PQFN-16LD
14625 4.5 30000 29250 Plastic Surface Mount
Yes
XX1010-QT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
Integrated Gain, Doubler and Driver Stages
RoHS* Compliant
260°C Reflow Compatible
Lead-Free 3 mm 16-Lead QFN Package
100% RF, DC and Output Power Testing
On-Chip ESD Protection
30 dBc Fundamental Suppression
+20 dBm Output Saturated Power
Integrated Bypassing Capacitor
+4.5 V Single Positive Bias
15000 X1010
100% matte tin plate followed by a post-plating annealing of 1 hr at 150 C
3x3 mm-16 lead PQFN.jpg
20