混频器

混频器

MACOM公司的混频器可用于多种应用,如调制器、相位检测器、频率合成器和转换器等。它们是CATV前端系统和上变频器的最佳选择。这些低成本无源混频器采用宽带铁氧体平衡-不平衡转换器及配套的硅肖特基二极管构建而成。

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部件号 订货 描述 Min Frequency, RF/LO (MHz) Max Frequency, RF/LO (MHz) Min Frequency, IF (MHz) Max Frequency, IF (MHz) 封装 ROHS 模型数据(Sparameters) 产品照片 LO Drive (dBm) Isolation LO-RF (dB) Input P1dB (dBm) 75欧姆 封装类别 无铅 硬件手册 应用笔记 特性 优势 标志 引线精加工 兼容部件 Conversion Loss (dB) MSL ESD 产品介绍 产品公告 外形图 质量报告 Brightcove视频 ADS & SPICE模型信息 数据手册封装概述 设备固件 EVM GUI软件 EVM用户手册 目录 Xmicrowave URL Xmicrowave Image
 
 
 
 
 
 
 
 
MAMX-011009 询问 Sub-Harmonic Pumped Mixer 14 - 32 GHz
4000 32000 0 7000 1.5X1.2mm TDFN-6LD
Yes
1.2x1.5mm_6-lead.jpg
25 No
Plastic Surface Mount
Yes
MAMX-011009.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
Up or Down Frequency Mixer
LO Frequency: 4 - 20 GHz
RF Frequency: 14 - 32 GHz
2xLO & 3xLO Rejection: 50 dB
Low Conversion Loss: 11 dB
Halogen-Free “Green” Mold Compound
Lead-Free 1.5x1.2 mm 6-lead TDFN Package
IF Frequency: DC - 7 GHz
RoHS* Complaint
260°C Reflow Compatible
-10 3203639724001
http://www.xmicrowave.com/product/xm-a4a4-0404d/
Xmicrowave.png
MAMX-009239-001500 采购 E-Series Surface Mount Mixer 10 – 2500 MHz
10 2500 10 2500 SM-87
SM 87 - MAMX-009239-001500.JPG
17 9 13 No
FR4 Surface Mount
No
MAMX-009239-001500.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Lo Power: +17 dBm
RoHS* Compliant
Wide Frequency Band ·
Surface Mount
Up to +13 dBm RF
Tape and Reel Packaging
9
MAMX-009722-25MHLP 询问 E-Series Surface Mount Mixer 30-512 MHz
30 512 SM-89
SM 89 - MAMX-009722-25MHLP.JPG
23 45 No
FR4 Surface Mount
Yes
MAMX-009722-25MHLP.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Lo Power: +13 dBm
RoHS* Compliant
260°C Reflow Compatible
Tape and Reel Packaging Available
Surface Mount
Up to +9 dBm RF
7.5
MA4EX600L1-1225T 询问 Silicon Double Balanced HMIC Mixer 1700 – 2500 MHz
4200 6000 0 2000 SOT-25
Yes
MA4EX600L1-1225T.PNG
5 28 6.9 No
Plastic Surface Mount
Yes
MA4EX600L1-1225.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
SOT-25 Low Cost Miniature Plastic Package
No External Matching Required
HMICTM Patented Process
+ 3 to + 7 dBm Lo Drive
6.4 dB Typical Conversion Loss @ 5000 MHz
Lead Free ( RoHS Compliant ) with 260 °C Reflow Capability
Double Balanced Passive Mixer
100 % Matte Tin Plating
5.8
MAMX-000900-1061LT 询问 Silicon Double Balanced HMIC Mixer 700—1400 MHz
700 1400 0 400 SOIC8
soic-8.jpg
7 37 1.9 No
Plastic Surface Mount
Yes
MAMX-000900-1061LT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
+ 3 to + 7 dBm
RoHS* Compliant
100% Matte Tin Plating
Low Cost Surface Mount Package
No External Matching Required
Fully Balanced Passive Mixer
260 °C Reflow Capability
6.7
MA4EXP950H1-1277T 采购 Silicon Double Balanced HMIC Mixer 850 - 1050 MHz
850 1050 0 200 3mm PQFN-16LD
3x3 mm-16 lead PQFN (LP).jpg
15 55 12.7 No
Plastic Surface Mount
Yes
MA4EXP950H1-1277T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
+ 35 dBm Typical Input IP3
RoHS* Compliant with 260 °C. Reflow Capability
Low Cost Miniature Plastic MLP Package
NO External Matching Required
Fully Balanced Passive Mixer
+ 15 to + 19 dBm LO Drive
8. 3 dB Typical Conversion Loss
100% MATTE Tin Plating
8.3
MAMX-008611 询问 Low Cost MMIC Mixer with Local Oscillator Amplifier 0.8 - 1.0 GHz
800 1000 170 SOT-26
SOT-26.jpg
-5 28 14 No
Plastic Surface Mount
Yes
MAMX-008611.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
-5 to +5 dBm LO Drive Level
260°C Re-flow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead Free SOT-26 package
High Isolation, 28 dB LO to RF
RoHS Compliant Version of MD57-0001
9.3
MAMX-008174-CXD860 采购 E-Series Surface Mount Mixer 1 to 1000 MHz
1 1000 1 1000 SM-134
SM 134.JPG
7 30 1 Yes
Module/Pallet
Yes
MAMX-008174-CXD860.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Surface Mount
RoHS* Compliant
260°C Reflow Compatible
Low Profile
RF Power up to +1dBm
Lo Power +7dBm
RoHS Version of MAMXES0028
Available on Tape and Reel
7.5
MA4EXP190H1-1277T 询问 High IP3 Double Balanced
1725 2125 0 400 3mm PQFN-16LD
3x3 mm-16 lead PQFN (LP).jpg
15 48 11.3 No
Plastic Surface Mount
Yes
MA4EXP190H1-1277T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
8.4
MAMX-000950-1225MT 采购 Silicon Doubled Balanced HMIC Mixer 700 - 1200 MHz
700 1200 0 400 3mm PQFN-16LD
3x3 mm-16 lead PQFN (LP).jpg
10 62 8.1 No
Plastic Surface Mount
Yes
MAMX-000950-1225MT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
SOT-25 Low Cost Miniature Plastic Package
100% Matte Tin Plating
DC - 400 MHz IF Bandwidth
Silicon Medium Barrier Schottky Diodes
HMIC™ Patented Process
+7 to +13 dBm LO Drive
7.0 dB Typical Conversion Loss
RoHS* Compliant
260 °C Reflow Capability
8.2
MAMX-007238-CM25MH 采购 E-Series Surface Mount Mixer 5-2500 MHz
2 2500 2 2500 SM-87
SM 87 - MAMX-007238-CM25MH.JPG
13 20 1 No
FR4 Surface Mount
Yes
MAMX-007238-CM25MH.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Lo Power +13 dBm
RoHS* compliant version of the ELCM-25MH
260°C Reflow Compatible
Tape and Reel Packaging Available
Surface Mount
Up to +9 dBm RF
7.3
MAMX-007247-MRS5MH 采购 E-Series Surface Mount Mixer 5 – 1500 MHz
5 1500 5 1500 SM-1
SM 1 - MAMX-007247-MRS5MH.JPG
13 30 9 No
Ceramic Surface Mount
Yes
询问 AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Lo Power +13 dBm
Tape and Reel Packaging Available
RoHS* Compliant Version of the EMRS-5MH
Surface Mount
Up to +9 dBm RF
7.5
MAMX-007607-ELCM1H 采购 E-Series Surface Mount Mixer 0.5 – 500 MHz
0.5 500 0.5 500 SM-87
Yes
SM 87 - 2.JPG
17 35 14 No
FR4 Surface Mount
Yes
MAMX-007607-ELCM1H.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
LO Power +17 dBm
RoHS* compliant version of the ELCM-1HTR
260°C Reflow Compatible
Tape and Reel Packaging Available
Surface Mount
Low Profile
Up to +14 dBm RF
7.2
MAMX-090950-1277LT 采购 Silicon Double Balanced HMIC Mixer 850 - 1050 MHz
850 1050 0 400 3mm PQFN-16LD
3x3 mm-16 lead PQFN (LP).jpg
7 62 4.3 No
Plastic Surface Mount
Yes
MAMX-090950-1277LT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
Input IP3: +21 dBm (Typ.)
Lead Free
Low Cost Miniature Plastic MLP Package
Fully Balanced Passive Mixer
Lo Drive: +5 to +10 dBm
Conversion Loss: 8.3 dB (Typ,)
100% Matte Tin Plating
260°C Reflow Compatible
RoHS* Compliant
8.2
MA4EXP240L-1277T 采购 Silicon Double Balanced HMIC Mixer 2300 - 2800 MHz
2300 2800 0 200 3mm PQFN-16LD
3x3 mm-16 lead PQFN (LP).jpg
5 51 4.8 No
Plastic Surface Mount
Yes
MA4EXP240L-1277.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
S2083 - Surface Mounting Instructions for PQFN Packages
AG314 - Principles, Applications and Selection of Receiving Diodes
AG314 - Principles, Applications and Selection of Receiving Diodes
+ 18 dBm Typical Input IP3
100 % MATTE Tin Plating
RoHS* Compliant
No External Matching Required
Fully Balanced Passive Mixer
+ 5 to + 9 dBm LO Drive
8. 3 dB Typical Conversion Loss
260 °C Reflow Capability
8.3
MA4EX950L1-1225T 采购 Silicon Double Balanced HMIC Mixer 700 - 1200 MHz
700 1200 0 400 SOT-25
Yes
SOT 25.JPG
5 28 1.5 No
Plastic Surface Mount
Yes
MA4EX950L1-1225T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
SOT-25 Low Cost Miniature Plastic Package •• • • • •
260°C Reflow Capability
100 % Matte Tin Plating
DC - 400 MHz IF Bandwidth
Silicon Low Barrier Schottky Barrier Diodes
HMICTM Patented Process
+3 to +7 dBm LO Drive
6.5 dB Typical Conversion Loss
RoHS* Compliant
8 http://www.xmicrowave.com/product/xm-a4b3-0404d/
Xmicrowave.png
MA4EX190H1-1225T 采购 Silicon Double Balanced HMIC Mixer 1700 - 2300 MHz
1700 2300 0 500 SOT-25
Yes
doublebalancedmixer.PNG
15 30 10.5 No
Plastic Surface Mount
Yes
MA4EX190H1-1225T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Low Cost Miniature Plastic Package
DC - 500 MHz IF Bandwidth
Silicon High Barrier Schottky Diodes
HMIC™ Process
+13 to +17 dBm LO Drive
6.7 dB Typical Conversion Loss at 2200 MHz
6.6 dB Typical Conversion Loss at 1900 MHz
100% MATTE Tin Plating
260 °C. Reflow Capability
RoHS* Compliant
6.6
MA4EX950H1-1225T 采购 Silicon Double Balanced HMIC Mixer 700 - 1200 MHz
700 1200 0 400 SOT-25
Yes
MACOM_general.png
15 27.5 8.3 No
Plastic Surface Mount
Yes
MA4EX950H1-1225T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
7.0 dB Typical Conversion Loss
100% Matte Tin Plating
Low Cost Miniature Plastic Package
DC - 400 MHz IF Bandwidth
Silicon High Barrier Schottky Barrier Diodes
HMIC IC Process
+13 to +17 dBm LO Drive
RoHS* Compliant
260°C Reflow Capability
6.6 http://www.xmicrowave.com/product/xm-a4b2-0404d/
Xmicrowave.png
MAMXSS0013 询问 Low Cost MMIC Mixer 1400 - 2100 MHz
1400 2100 0 500 SOT-25
Yes
MAMXSS0013.PNG
5 28 12 No
Plastic Surface Mount
Yes
MAMXSS0013.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
+12 dBm Input Power @ 1 dB Compression
RoHS* Compliant Version of MD54-0006
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOT-25 Package
Does Not Require DC Bias
Lo Drive Level: +3 to +8 dBm
High Isolation: 28 dB LO to RF
DC - 500 MHz 3 dB IF Bandwidth
8 http://www.xmicrowave.com/product/xm-a4b6-0404d-2/
Xmicrowave.png
MAMXSS0010 采购 MMIC Medium Level Mixer 1700 - 2000 MHz
1700 2000 0 200 SOIC8
soic-8.jpg
13 27 21 No
Plastic Surface Mount
Yes
MAMXSS0010.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Low Conversion Loss
Lead-Free SOIC-8 Package
DC - 200 MHz IF Bandwidth
Lo Drive Level: +11 to +23 dBm
Typical Two-Tone IM Ratio: > 50 dBc
Input Power @ 1 dB Compression: +21 dBm
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
260°C Reflow Compatible
RoHS* Compliant Version of MD54-0003
8.5
MA4EX580L1-1225T 采购 Silicon Double Balanced HMIC Mixer 4.7 - 6.0 GHz
4700 6000 0 1050 SOT-25
Yes
doublebalancedmixer.PNG
5 23 1.6 No
Plastic Surface Mount
Yes
MA4EX580L1-1225T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Conversion Loss: 7.6 dB (Typ.)
Low Cost Miniature Plastic Package
DC - 1050 MHz IF Bandwidth
Silicon Low Barrier Schottky Diodes
HMIC™ Patented Process
LO Drive : +3 to +7 dBm
Lead Free
RoHS* Compliant
7.6 http://www.xmicrowave.com/product/xm-a4a9-0404d/
Xmicrowave.png
MAMXSS0012 询问 Low Cost MMIC Mixer 800 - 1000 MHz
800 1000 0 200 SOT-25
Yes
SOT 25.JPG
5 35 15 No
Plastic Surface Mount
Yes
MAMXSS0012.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Input Power @ 1 dB Compression: +15 dBm
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOT-25 Package
Does not require DC Bias
DC - 200 MHz 3 dB IF Bandwidth
LO Drive Level: +3 to +8 dBm
High LO to RF Isolation: 35 dB
260°C Reflow Compatible
RoHS* Compliant Version of MD54-0005
8 http://www.xmicrowave.com/product/xm-a4b5-0404d/
Xmicrowave.png
MA4EX240L1-1225T 采购 Silicon Double Balanced HMIC Mixer 1700 - 2500 MHz
1700 2500 0 400 SOT-25
Yes
doublebalancedmixer.PNG
5 17.5 1 No
Plastic Surface Mount
Yes
MA4EX240L1-1225T.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Low Cost Miniature Plastic Package
Silicon Low Barrier Schottky Diodes
HMIC™ Patented Process
+3 to +7 dBm LO Drive
7.4 dB Typical Conversion Loss at 2400 MHz
6.4 dB Typical Conversion Loss at 2100 MHz
RoHS* Compliant with 260 °C. Reflow Capability
DC - 400 MHz IF Bandwidth
100% MATTE Tin Plating
7 http://www.xmicrowave.com/product/xm-a4a8-0404d/
Xmicrowave.png
MAMXES0117 采购 E Series Surface Mount Mixer 1-1000 MHz RoHS Compliant
80 2500 0 1000 SM-2
SM 2 - Module Pallet.jpg
17 28.9 14 No
Module/Pallet
Yes
MAMXES0117.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
LO Power: +17 dBm
Tape and Reel Packaging Available
RoHS* Compliant version of the ESMD-C50H
Surface Mount
Up to +14 dBm RF
7.34
MAMXSS0011 询问 MMIC Medium Level Mixer 800 - 1000 MHz
800 1000 0 100 SOIC8
soic-8.jpg
13 38 21 No
Plastic Surface Mount
Yes
MAMXSS0011.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
Low Conversion Loss
RoHS* Compliant Version of MD54-0004
260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
100% Matte Tin Plating over Copper
Lead-Free SOIC-8 Package
DC - 100 MHz IF Bandwidth
Lo Drive Level: +11 to +23 dBm
1 dB Compression: +21 dBm
7.5
MAMXES0115 采购 E-Series Surface Mount Mixer 1 – 1000 MHz
5 1000 0 1000 SM-89
MACOM_general.png
7 25 1 No
FR4 Surface Mount
Yes
MAMXES0115.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
Lo Power: +7 dBm
RoHS* Compliant
Tape and Reel Packaging Available
Low Profile
Surface Mount
Up to +1 dBm RF
260 °C Reflow Capability
7
XM1003-BD 询问 Image Reject Mixer 32.0-42.0 GHz
32000 42000 0 4000 DIE
MACOM_general.png
-40 No
Die
Yes
XM1003-BD.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
Sub-harmonic Image Reject Mixer
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF Testing
Image Rejection: 18.0 dB
Conversion Loss: 9.0 dB
GaAs HBT Technology
260°C Reflow Compatible
RoHS* Compliant
9
XM1001-BD 询问 Image Reject Mixer 12.0-40.0 GHz
12000 40000 0 4000 DIE
MACOM_general.png
16 No
Die
Yes
XM1001-BD.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
Fundamental Image Reject Mixer
RoHS* Compliant
260°C Reflow Compatible
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF Testing
Image Rejection: 20.0 dB
Conversion Loss: 8.0 dB
+25.0 dBm Input Third Order Intercept (IIP3)
8
XM1002-BD 询问 Image Reject Mixer 34.0-46.0 GHz
34000 46000 0 4 DIE
MACOM_general.png
11 No
Die
Yes
XM1002-BD.pdf
AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
M570 - Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMICs
Fundamental Image Reject Mixer
260°C Reflow Compatible
100% Visual Inspection to MIL-STD-883 Method 2010
100% On-Wafer RF Testing
+24 dBm Input Third Order Intercept
20.0 dB Image Rejection
7.0 dB Conversion Loss
RoHS* Compliant
8
MAMX-000600-1225MT 询问 Silicon Doubled Balanced HMIC Mixer 4200 - 6000 MHz
4200 6000 0 2000 SOT-25
Yes
doublebalancedmixer.PNG
10 27 2.7 No
Plastic Surface Mount
Yes
MAMX-000600-1225MT.pdf
AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
M538 - Surfacing Mounting Instructions - Footprint Guidelines
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
SOT-25 Low Cost Miniature Plastic Package
100% Matte Tin Plating
RoHS* Compliant
260 °C Reflow Capability
Double Balanced Passive Mixer
Silicon Medium Barrier Schottky Diodes
HMIC™ Patented Process
LO Drive: +7 to +13 dBm
6.5 dB Typical Conversion Loss
6.5
MAMX-007253-ES0067 询问 E-Series Surface Mount Mixer 10 – 2000 MHz
10 2000 10 800 SM-2
SM 2 - Module Pallet.jpg
10 30 No
Module/Pallet
Yes
询问 AN3009 - S-Parameter S2P File Format Guide
M513 - Tape and Reel Packaging for Surface Mount Components
S2080 - Moisture Effects on the Soldering of Plastic Encapsulated Devices
AG314 - Principles, Applications and Selection of Receiving Diodes
LO Power +10 dBm
260°C Reflow Compatible
Tape and reel packaging available
Surface Mount
5 dBm RF
RoHS* compliant version of the MAMXES0067
8
MAMX-011023 询问 Low Noise Active Mixer, 4 – 23 GHz
4000 23000 0 8000 1.5x1.2mm 6 lead TDFN
1.2x1.5mm_6-lead.jpg
-2 No
Plastic Surface Mount
Yes
MAMX-011023 (1).pdf
Down Frequency Mixer
LO Frequency: 4 – 23 GHz
RF Frequency: 4 – 23 GHz
Low Power Consumption: 3v/15mA
Low Noise: 7 dB Typical
Conversion Gain: 7 dB Typical
Halogen-Free “Green” Mold Compound
Lead-Free 1.5x1.2mm 6 lead TDFN Pkg
IF Frequency: DC – 8 GHz
RoHS Complaint and 260oC Reflow
7 Family of Mixers Training Module with Digikey.pdf
MAMX-011021 询问 High IP3 Mixer, 5 - 33 GHz
5000 33000 0 5000 1.5x1.2mm 6 lead TDFN
Yes
1.2x1.5mm_6-lead.jpg
14 15 No
Plastic Surface Mount
Yes
MAMX-011021.pdf
Passive Frequency Mixer
LO Frequency: 3-39 GHz
RF Frequency: 5-33 GHz
High IIP3: +22 dBm
Conversion Loss : 9 dB typical
Lead-Free 1.5x1.2mm 6 lead TDFN Package
IF Frequency: DC-5 GHz
RoHS* Compliant and 260°C Reflow Compatible
Halogen-Free “Green” Mold Compound
9 Family of Mixers Training Module with Digikey.pdf
http://www.xmicrowave.com/product/xm-a4a5-0404d/
Xmicrowave.png
MD-156 询问 600 3000 0 1000 FP-2
Flatpack package.png
30 FP-2
询问 Noise Figure: 6.5 Typical
MIL-STD-883 Screening Available
IF Port Current: 50 mA Max
Maximum Input Power: 300 mW max. @ 25°C, Derated linearly to 85°C @ 3.2 mW/°C
Impedance: 50 Ohms Nominal
LO-RF Isolation: 30 dB Typical
9