2.5G Distributed Feedback Lasers

2.5G Distributed Feedback Lasers

MACOM’s Distributed Feedback (DFB) laser diodes are designed for direct modulation uncooled operation up to 2.5G. These products utilize patented Etched Facet Technology (EFT) for exceptional reliability with the below benefits:

  • EFT Technology enabling high performance and product uniformity
  • Non-hermetic packaging ideal for Silicon Photonics based Data Center applications
  • Monolithic surface emission and beam shaping for alignment with Silicon Photonics
  • No isolator required due to high back-reflection rejection

Products are RoHS compliant, designed for Telcordia GR-468 and available either as tested dies on blue tape or packaged TO-56 can.

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releaseDate Part Number Ordering Short Description Max Data Rate (Gbps) Wavelength (nm) Package Size Package Type Benefits Features Product Image Datasheet Temp Options
 
 
131D-02E-VT5MB-502 Inquire TO, laser, 2.5G DFB NFF, 2mm Ball Lens (6.7mm FL), Pinout Type B
2.5 1310 TO-56
Design for non-hermetic package
High reliability
1310 nm wavelength
Design for Telcordia GR-468
RoHS compliant
Edge emitting laser (EEL)
Uncooled operation, -20 to 85°C
Narrow Farfield (NFF)
Direct modulation up to 2.5 Gbps
131D-02E-VT5xB-502.pdf
-20º to 85º
131D-02E-VT5TB-50x Inquire TO, laser, 2.5G DFB NFF, 2mm Ball Lens (6.6mm FL), Pinout Type B
2.5 1310 TO-56
Design for non-hermetic package
High reliability
1310 nm wavelength
Edge emitting laser (EEL)
Uncooled operation, -20º to 85°C
Narrow Farfield (NFF
Direct modulation up to 2.5 Gbps
Design for Telcordia GR-468
RoHS compliant
131D-02E-VT5xB-502.pdf
-20º to 85º
131D-02E-VCT11-50x Inquire Die, laser, 2.5G DFB NFF, small size, chip on tape
2.5 1310 265 x 250 x 100um
Die
High fiber coupling efficiency
On-wafer mapping/screening
Design for non-hermetic package
100% tested over temperature
Small size die: 265 x 250 x 100um
Design for Telcordia-GR468
RoHS compliant
Edge emitting laser (EEL)
Uncooled operation, -20 to 85°C
Direct modulation up to 2.5Gbps
Narrow beam divergence angle (NFF)
1310nm wavelength
131D-02E-VCT11-500.pdf
-20º to 85º
2017/09/04 127D-02I-VT5AB Inquire 1270 nm Edge Emitting Narrow Farfield DFB Laser
2.5 1270 Aspherical lens cap (FL=7.5mm) in hermetic TO-56 package
TO-56
Directly modulated 2.5 Gbps 1270 nm DFB Narrow Farfield (NFF) laser diode chips
Available with aspherical lens cap (FL=7.5 mm) in hermetic TO-56 package, integrated InGaAs monitoring photodiode and Type B pinout (common anode)
Inquire -40º to 85ºC
2015/03/30 131D-02I-LCT11-07 Inquire 2.5G 1310nm DFB Std LD
2.5 1310 300 x 250 x 100
Die
Design for non-hermetic package
On-wafer mapping/screening
100% tested over temperature
1310nm wavelength
Direct modulation up to 10Gbps
Uncooled operation
Edge emitting laser (EEL)
RoHS compliant and Design for Telcordia-GR468
131D-02x-Lxx11.png
Inquire -40º to 85ºC
2015/03/30 131D-02I-LT5MB Inquire 2.5G 1310nm DFB Standard (Std) TO-Can
2.5 1310 TO-56
TO-Can
Hermetic Package
High reliability
1310 nm wavelength
Direct modultation up to 2.5Gbps
Uncooled operation, -40°C to 85°C operating temp range
Edge emitting laser (EEL)
RoHS compliant and Design for Telcordia GR-468
TO-56 package with lens options
TOCAN.png
131D-02I-LT5MB.pdf
-40º to 85ºC
2017/12/28 127D-02x-VCT11 Inquire 1270nm Edge Emitting Narrow Farfield DFB Laser
2.5 1270 265 x 250 x 100um die
Bare Die
127D-02x-Vxx11_Rev1.pdf
-40°C to 95°C
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