MNS

电容器

MACOM公司的片式电容器可广泛用于商业及航空航天与国防应用。我们的电容器设计用于在以Ku波段频率工作的各种混合微波电路应用中实现长期可靠性和可重复性。MACOM的电容器具有单位面积电容量更高的独特优势,因此对于给定的电容,芯片更小。

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部件号 订货 描述 Capacitance (pf) Standoff Voltage (V) Chip Style ADS & SPICE模型信息 应用笔记 优势 Brightcove视频 兼容部件 目录 数据手册封装概述 硬件手册 设备固件 ESD EVM GUI软件 EVM用户手册 特性 引线精加工 无铅 MSL 标志 模型数据(Sparameters) 外形图 封装 封装类别 Pad Types 产品介绍 产品公告 产品照片 质量报告 ROHS
 
 
 
MA4M2020 采购 MNS Microwave Chip Capacitors
20 200 132 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Round Bonding Pad
MACOM_general.png
MA4M1100 采购 MNS Microwave Chip Capacitors
100 100 199 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Round Bonding Pad
MACOM_general.png
MA4M3150 询问 MNS MW Chip
150 50 359 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
MA4M1050 询问 1 MNS Microwave Chip Capacitors
50 100 132 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Round Bonding Pad
MACOM_general.png
MA4M3030 采购 MNS Microwave Chip Capacitors
30 200 352 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
MA4M3010 采购 MNS Microwave Chip Capacitors
10 200 350 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot) • • •
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
MA4M3100 采购 MNS Microwave Chip Capacitors
100 50 358 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png
MA4M3050 采购 MNS Microwave Chip Capacitors
50 200 354 AN3009 - S-Parameter S2P File Format Guide
AN3018 - Known Good Die Delivery Specification
M513 - Tape and Reel Packaging for Surface Mount Components
MA4Mxxxx Series.pdf
Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot)
Available with Round or Square Bond Pads
Low Loss, High Q
Small Size
Yes
DIE
Die/Bumped Die
Square Bonding Pad
MACOM_general.png