产品详细信息

MADP-042405-130600
Surmount PIN Diode
This device is a Silicon-Glass PIN diode chip fabricated with MACOM's patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical conic topology provides for exceptional heat transfer from the active area. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These surmount devices are suitable for usage in moderate incident power (5W C.W.) or higher incident peak power (50W) series, shunt, or series-shunt switches. Lower parasitic inductance, 0.45nH, and excellent RC constant (0.23pS), make the devices ideal for higher frequency switch elements compared to their plastic device counterparts.
特性
  • Surface Mount
  • RoHS Compliant
  • High Average and Peak Power Handling
  • Low Parasitic Capacitance and Inductance
  • Polymer Scratch Protection
  • Silicon Nitride Passivation
  • Rugged Silicon-Glass Construction
  • No Wirebonds Required
Applications
  • Aerospace and Defense
  • ISM
规范
  • Total Capacitance: 0.27 pF
  • Total Capacitance: 0.27 pF
  • Resistance: 0.8 Ohm
  • CW Power Dissipation: 1.3 W
  • Min Frequency: 50 MHz
  • Breakdown Voltage, Minimum: 80 V
  • Thermal Resistance: 115 
  • Lifetime: 210 nS
  • Max Frequency: 4,000 MHz
Package
  • ODS-1306 Die
Package Category
  • Surface Mount Die
Part Number Package MACOM Richardson RFPD DigiKey Mouser richardson-electronics
MADP-042405-130600
Diode, HMIC, PIN, Surmount, Vertical Via
ODS-1306 询问 采购

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