产品详细信息

MADP-042908-130600
Surmount PIN Diode
This device is a silicon, glass PIN diode surmount chip fabricated with MACOM’s patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These packageless devices are suitable for moderate incident power applications, = 10W/C.W. or where the peak power is = 52W, pulse width is = 1µS, and duty cycle is = 0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts.
特性
  • Surface Mount
  • RoHS Compliant
  • High Average and Peak Power Handling
  • Low Parasitic Capacitance and Inductance
  • Polymer Scratch Protection
  • Silicon Nitride Passivation
  • Rugged Silicon-Glass Construction
  • No Wire Bonding Required
Applications
  • Aerospace and Defense
  • ISM
规范
  • Total Capacitance: 0.06 pF
  • Total Capacitance: 0.06 pF
  • CW Power Dissipation: 0.8 W
  • Resistance: 3.1 Ohm
  • Min Frequency: 50 MHz
  • Breakdown Voltage, Minimum: 100 V
  • Thermal Resistance: 185 
  • Lifetime: 230 nS
  • Max Frequency: 16,000 MHz
Package
  • ODS-1306 Die
Package Category
  • Surface Mount Die
Part Number Package MACOM Richardson RFPD DigiKey Mouser rell
MADP-042908-130600
Diode, HMIC, Surmount, PIN, 8um
ODS-1306 询问

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