Product Detail

The MMP7077 MELF PIN diode is a thick I layer, low series resistance, low capacitance PIN diode available in a magnetic or in a nonmagnetic, square MELF hermetic ceramic package. It is manufactured using MACOM proprietary diode process which optimizes the anode and cathode terminals of the die for full-face metallurgical bonds to the heat-spreading metal posts within the ceramic package. This unique geometry provides low electrical and thermal resistance within the surface mount package to enable high average power handling, low insertion loss for series diode applications and high isolation for shunt diode applications. The low thermal resistance (< 20 ºC/W) of the MMP7077 enables the device to safely handle high power signals in HF to UHF cold and hot switching applications, for RF incident power levels of 47 dBm CW and 57 dBm peak. The low series resistance (< 0.5 O), and low total capacitance (< 1 pF) produce excellent isolation and insertion loss in switch or attenuator applications. This rugged device is hermetically sealed and capable of reliable operation in all military, commercial and industrial applications. The device is RoHS compliant.
  • High Average Power Handling: > 50 W CW
  • RoHS Compliant
  • Low Thermal Resistance: < 20 ºC/W
  • Thick I Layer for High Third Order Intercept: W = 80 µm Typical
  • Low Capacitance for Low Insertion Loss and High Isolation: CT < 1 pF
  • Low Series Resistance for Low Insertion Loss and High Isolation: RS < 0.5 O
  • Available in Magnetic (CS127-1) or Nonmagnetic (CS128-1), Hermetically Sealed Surface Mount Package
  • average power switch and attenuator applications
  • Lifetime: 3 nS
  • Total Capacitance: 1 pF
  • Resistance: 0.5 Ohm
  • Breakdown Voltage, Minimum: 200 V
  • Thermal Resistance: 20 
  • CS128-1
Package Category
  • various
  • Yes
Part Number Package MACOM Richardson RFPD DigiKey Mouser Richardson Electronics
CS128-1 Inquire

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